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Description
No descriptionConfiguration
No ConfigurationOEM Model Description
EBARA's CMP system Model F-REX is Chemical Mechanical Polishing system that enables nanometer level planarity (10~20nm on 300mm wafer) in semiconductor manufacturing process. Ebara's CMP system, Model F-REX200M2 and F-REX300X has achieved both an advanced process performance and high productivity. This is made possible with "1-head per 1-table" unique architecture processing an individual wafer delicately while the "4 table platform" enables high throughput.Documents
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Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
82435
Wafer Sizes:
12"/300mm
Vintage:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EBARA
F-REX300X
CATEGORY
CMP
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
82435
Wafer Sizes:
12"/300mm
Vintage:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
EBARA's CMP system Model F-REX is Chemical Mechanical Polishing system that enables nanometer level planarity (10~20nm on 300mm wafer) in semiconductor manufacturing process. Ebara's CMP system, Model F-REX200M2 and F-REX300X has achieved both an advanced process performance and high productivity. This is made possible with "1-head per 1-table" unique architecture processing an individual wafer delicately while the "4 table platform" enables high throughput.Documents
No documents