This 300mm CPM system uses EBARA’s Dry-In/ Dry-Out processing and two-head/ two platen design for maximum operation flexibility. Features include 3-step cleaning, 4 FOUP loading ports, and buff stations.

EBARA

F-REX300

The Ebara FREX 300 S is a 300mm CMP system, featuring a four-head, four-platen design with a three-step clean process. It reliably meets 7nm tech requirements, providing development and production flexibility, and best-in-class reliability and cost of ownership.

F-REX300S

The integrated post-CMP Desica® cleaner uses unique full-immersion Marangoni® vapor drying technology to virtually eliminate watermark defects and dramatically reduce particle contamination. The wafer is so clean after CMP (<100 45nm defects on a 300mm wafer) that compared to the entire surface area of the earth, the remaining contaminants would cover only 0.3 acres, the size of a medium sized suburban garden

The Applied Reflexion LK CMP system also implements a full suite of endpoint methods, in-line metrology and advanced process control capabilities that ensure excellent within-wafer and wafer-to-wafer process control and repeatability for all planarization applications. Its patented window-in-pad technology enables accurate real-time polish control of every wafer without compromising throughput. The new FullVision™ in-situ endpoint system, for all stop-in and stop-on dielectric applications, uses broadband spectroscopy to significantly improve Cpk and minimize wafer scrap caused by drifts in consumable sets and incoming wafer variations.

Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

CMP

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F-REX300

F-REX300S

REFLEXION LK

EPO 222