DISCO develops, manufactures, and sells precision machines and precision processing tools.

2011
Developed the ultra high precision DFS8960 surface planer which supports 300 mm wafers.

Fully-automatic surface planer for Φ300 mm wafers
Φ300 mm         2 axes, 2 chuck tables          Planarization

Ultrahigh-precision planarization technology using a diamond bit
The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.

DISCO

DFS8960

The DFS8910 is a fully-automatic surface planer for Φ8-inch wafers. It has 1 axis and 1 chuck table. It uses ultrahigh-precision planarization technology with a diamond bit to provide solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.

DFS8910

The DAS8920 is a semi-automatic surface planer for Φ8-inch wafers (Φ200 mm) with 1 axis and 1 chuck table. It uses ultrahigh-precision planarization technology with a diamond bit to provide solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.

DAS8920

The DAS8930 is a semi-automatic surface planer for Φ300 mm wafers, with 1 axis and 1 chuck table, manufactured by Disco Corporation1. It uses ultrahigh-precision planarization technology with a diamond bit to provide solutions for high-precision planarization of ductile materials such as metals, resins, and their composites, as well as solutions for reducing bump height variation and surface roughness.

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DFS8960

DFS8910

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