DISCO develops, manufactures, and sells precision machines and precision processing tools.

The DAS8920 is a semi-automatic surface planer for Φ8-inch wafers (Φ200 mm) with 1 axis and 1 chuck table. It uses ultrahigh-precision planarization technology with a diamond bit to provide solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.

DISCO

DAS8920

The DFS8910 is a fully-automatic surface planer for Φ8-inch wafers. It has 1 axis and 1 chuck table. It uses ultrahigh-precision planarization technology with a diamond bit to provide solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.

DFS8910

The DAS8930 is a semi-automatic surface planer for Φ300 mm wafers, with 1 axis and 1 chuck table, manufactured by Disco Corporation1. It uses ultrahigh-precision planarization technology with a diamond bit to provide solutions for high-precision planarization of ductile materials such as metals, resins, and their composites, as well as solutions for reducing bump height variation and surface roughness.

DAS8930

2011
Developed the ultra high precision DFS8960 surface planer which supports 300 mm wafers.

Fully-automatic surface planer for Φ300 mm wafers
Φ300 mm         2 axes, 2 chuck tables          Planarization

Ultrahigh-precision planarization technology using a diamond bit
The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.

DFS8960

CMP polisher designed to process hard-to-process materials such as sapphire and SiC
Φ200 mm                1 axis, 2 chuck tables                 Wafer Thinning               Stress Releaf

Fully automatic operation
The DFP8141 is a fully automatic polisher which performs CMP processing from cassette to cassette. With the installation of a cleaning station, wafer cleaning and drying after processing are performed automatically.

For small workpieces made of difficult-to-process materials
The DFP8141 supports CMP for materials such as sapphire, SiC, LT, and LN.

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DAS8920

DFS8910

DAS8930

DFS8960

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