Axus Technology is a global OEM company based in Chandler, Arizona, bringing the latest surface processing solutions to emerging technology industries such as Semiconductor, MEMS, Automotive, Defense and Aerospace, Lifesciences, and IoT. Axus provide advanced CMP tools and technology, along with exceptional technical expertise for polishing, wafer cleaning, precision wafer grind processing, and legacy tools; making us them one of the best highly specialized technology suppliers and consulting services focused on engineering capability and efficiency in supporting the CMP market.

The Axus Surface wafer polisher is a fully automated, precision tool for CMP polishing of semiconductor wafers used to achieve flatness, uniformity and planarization on patterned/ device wafers. The Surface, which is based on the IPEC 472 chassis, features automatic wafer handling and optimizes wafer throughput and quality on a two-platen, two-step polishing tool platform. Designed to planarize wafers from 100mm to 200mm, the Surface is ideally suited for material polishing applications that require repeatability with operational and processing flexibility. The Surface comes standard with a 4-pass pneumatic system for the control of the wafer carrier’s multiple zones and the retaining ring, and is 200mm ready. 

AXUS TECHNOLOGY

Surface

The G&P Technology POLI-400L was designed to provide flexible CMP process capability for applications where ease of use, reliability, and a compact design are essential. Capable of working with substrates with up to 150mm diameter, the POLI-400L offers configuration choices in carrier type, conditioner technology, pad profiling, process measurement and monitoring systems. The POLI-400L utilizes an intuitive touch-screen user interface and a robust PLC control system that includes the multiple process steps and detailed process controls that users expect. Reliability and flexibility is further enhanced by relying on manual single substrate loading. The G&P Technology POLI-400L delivers high-value performance and research capability in a package that is compact and economical.

G&P POLI-400L

The G&P Technology POLI-1300 planarization tool is specifically designed for use in processing large format multilayer panels. The G&P POLI-1300PCB uses a large format carrier designed for use with rectangular substrates up to 530mm on a side. The rigid design of both the direct drive carrier and tool, coupled with efficient through-the-table slurry delivery, provides for efficient planarization with exceptional process uniformity and substrate-to-substrate repeatability. Using process hardware similar to that used in semiconductor CMP processing, the carrier assembly with the substrate backing film, is easy to load and securely holds the substrate in place for polishing

G&P POLI-1300

The G&P Technology POLI-610 Polishing tool is used for the precision surface preparation of very hard, brittle materials such as Silicon Carbide, Gallium Nitride, and Sapphire. This is an especially good polishing tool for such LED materials which require relatively long polishing cycles and significant application of down force to achieve the desired removal rate and surface quality. The POLI-610 polishing tool is an excellent choice for economical processing of 3″ (76mm) and 4″ (100mm) wafers using “batch: style processing. In the tradition of all G & P Technology tools and equipment, the POLI-610 is a versatile and flexible process tool already chosen by R&D laboratories, university research centers, consumables suppliers, substrate manufacturers, and developers of LED substrates, and III-V materials.

G&P POLI-610

CS200-ia (Integrated Aquarius Cleaner Configuration):
Advanced CMP System with fully integrated Double Sided Post-CMP cleaner for dry-in, dry-out applications

CAPSTONE CS200-ia

The G&P Technology POLI-762 Membrane Carrier CMP Tool is our most advanced and intelligent CMP tool designed for high versatility for 12”(300mm) CMP process development, materials evaluation and pre-production runs. The POLI-762 was also designed for advanced wafer manufactures and consumables suppliers.

G&P POLI-762

With the UltraPRo 3D-II Robotic Assisted Polisher, Axus Technology introduces a completely automated system for precision polishing of round, square, and rectangular 3-dimensional components. This polisher incorporates an industrial grade, 6-axis articulated robot with unique force/torque sensing and control capability as the polishing mechanism.

 UltraPRo 3D-II 

IPEC 776

The G&P Technology POLI-500 is used for the planarization of dielectric, conducting, and semiconductor thin films on silicon wafers and other substrate materials. This polishing tool is an excellent choice for processing 6” (150mm) and 8” (200mm) wafers. This tool is available in several different configurations depending upon the customer’s need for the carrier type, pad conditioning technology, pad profiling capability, and process measurement and monitoring control systems. In the tradition of all G & P Technology tools and equipment, the POLI-500 is a versatile and flexible process tool already chosen by R&D laboratories, university research centers, consumables suppliers, substrate manufacturers, and chip developers.

G&P POLI-500

CS200-ma (Multi-Load/Unload Aquarius Cleaner Configuration):
Can function as a standalone CMP polishing system, or as a fully automated Dry in-Dry out system with the integrated Double Sided Post-CMP cleaner
True Bridge tool, can run two different wafer sizes simultaneously

CAPSTONE CS200-ma

CS200-sa (Standalone Configuration):
Smallest footprint, most flexible architecture, dual wafer size processing with no hardware or software modification
Easily added to fabs with existing cleaning equipment
True Bridge tool, can run two different wafer sizes simultaneously

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

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Top AXUS TECHNOLOGY CMP

G&P POLI-400L

G&P POLI-1300

G&P POLI-610

Surface

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