Overview

The Axus Surface wafer polisher is a fully automated, precision tool for CMP polishing of semiconductor wafers used to achieve flatness, uniformity and planarization on patterned/ device wafers. The Surface, which is based on the IPEC 472 chassis, features automatic wafer handling and optimizes wafer throughput and quality on a two-platen, two-step polishing tool platform. Designed to planarize wafers from 100mm to 200mm, the Surface is ideally suited for material polishing applications that require repeatability with operational and processing flexibility. The Surface comes standard with a 4-pass pneumatic system for the control of the wafer carrier’s multiple zones and the retaining ring, and is 200mm ready.