This 300mm CPM system uses EBARA’s Dry-In/ Dry-Out processing and two-head/ two platen design for maximum operation flexibility. Features include 3-step cleaning, 4 FOUP loading ports, and buff stations.

EBARA

F-REX300

The Ebara FREX 300 S is a 300mm CMP system, featuring a four-head, four-platen design with a three-step clean process. It reliably meets 7nm tech requirements, providing development and production flexibility, and best-in-class reliability and cost of ownership.

F-REX300S

EPO 222

EPO 213

EPO 113

The F-REX300S2 and F-REX300X3SC offers a four head, four platen with three step clean design allowing for customized process recipes with the demonstrated capability to reliably meet 7nm technology requirements. 

F-REX300SII

EBARA FREX 200 is a CMP system which is used for wafer grinding, lapping, and polishing. The FREX 200 is compatible with 200mm wafer size.

F-REX200

EBARA's CMP system Model F-REX is Chemical Mechanical Polishing system that enables nanometer level planarity (10~20nm on 300mm wafer) in semiconductor manufacturing process. Ebara's CMP system, Model F-REX200M2 and F-REX300X has achieved both an advanced
process performance and high productivity. This is made possible with "1-head per 1-table" unique architecture processing an individual wafer delicately while the "4 table platform" enables high throughput.

F-REX300X

EPO 223

EPO 2228

EPO 222T

EPO-222D

EPO 222A

EPO-2226D

EPOS-010

EBARA's F-REX CMP system offers nanometer-level planarity (10~20nm on 300mm wafer) in semiconductor manufacturing. Models F-REX200M2 and F-REX300X achieve advanced process performance and high productivity. The unique "1-head per 1-table" architecture delicately processes individual wafers, while the "4 table platform" ensures high throughput.

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F-REX300

F-REX300S

EPO 222

EPO 213

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