F-REX200M2
Category
CMPOverview
EBARA's F-REX CMP system offers nanometer-level planarity (10~20nm on 300mm wafer) in semiconductor manufacturing. Models F-REX200M2 and F-REX300X achieve advanced process performance and high productivity. The unique "1-head per 1-table" architecture delicately processes individual wafers, while the "4 table platform" ensures high throughput.
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