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DISCO DGP8761
  • DISCO DGP8761
  • DISCO DGP8761
  • DISCO DGP8761
  • DISCO DGP8761
  • DISCO DGP8761
Description
No description
Configuration
No Configuration
OEM Model Description
The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.
Documents

No documents

verified-listing-icon

Verified

CATEGORY
Lapping, Polishing, Grinding

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

68928


Wafer Sizes:

Unknown


Vintage:

2010


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
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DISCO

DGP8761

verified-listing-icon
Verified
CATEGORY
Lapping, Polishing, Grinding
Last Verified: Over 60 days ago
listing-photo-036623a0cedf4aaeb9742557d2104d3a-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/41318/036623a0cedf4aaeb9742557d2104d3a/bd451bd98b10463aa1415e6ee3831533_8ada2e8df9434ef3977dade14bcbc6551201a_mw.jpeg
listing-photo-036623a0cedf4aaeb9742557d2104d3a-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/41318/036623a0cedf4aaeb9742557d2104d3a/1356ebb7e013406c8e039b350b421bc0_3709d57ebd1e45aa8fcd1797eab68029_mw.jpeg
listing-photo-036623a0cedf4aaeb9742557d2104d3a-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/41318/036623a0cedf4aaeb9742557d2104d3a/8ce9f08f51164ed7b0e5e9291039e09c_59af14267dc344739cfc6f5ab1a4c8e8_mw.jpeg
listing-photo-036623a0cedf4aaeb9742557d2104d3a-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/41318/036623a0cedf4aaeb9742557d2104d3a/5db991432d4e4d49b0c0ce093fb88061_230fb8d6e23d48828ce8ceb28bb108fb_mw.jpeg
listing-photo-036623a0cedf4aaeb9742557d2104d3a-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/41318/036623a0cedf4aaeb9742557d2104d3a/e1d88ab4d3b94ec1991e52cc3303bcc5_bd56eb2c99e2428c88f2c62d6d1a9c161201a_mw.jpeg
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

68928


Wafer Sizes:

Unknown


Vintage:

2010


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No description
Configuration
No Configuration
OEM Model Description
The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.
Documents

No documents

Similar Listings
View All