Description
This Tool will not come with HDDConfiguration
Oxide Etcher ➢ 4 SCCM Etch Chambers ➢ FOUP Opener: SELOP12F25-30U-14 ➢ Process Gases Used: N2, C4F8, Ar, O2, CH2F2, CHF3, CF4, C4F8, C3F8, C4F6, He/O2OEM Model Description
Telius-SP is a high-performance etching system designed for large diameter (300 mm) requirements. It is part of the Telius platform and offers improved productivity through increased throughput, a reduced footprint, and higher energy efficiency. The system can be fitted with various chamber applications, including DRM and SCCM chambers, to support a wide range of process areas. It can support up to 4 chambers and boasts a high throughput, compact design, and low cost of ownership (CoO). Additionally, the system is designed for ease of maintenance. Overall, Telius-SP is a versatile and cost-effective solution for large diameter etching needs.Documents
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TEL / TOKYO ELECTRON
TELIUS SP 305 SCCM
Verified
CATEGORY
Plasma Etch
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
44210
Wafer Sizes:
12"/300mm
Vintage:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
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TEL / TOKYO ELECTRON
TELIUS SP 305 SCCM
Verified
CATEGORY
Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
44210
Wafer Sizes:
12"/300mm
Vintage:
2008
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
This Tool will not come with HDDConfiguration
Oxide Etcher ➢ 4 SCCM Etch Chambers ➢ FOUP Opener: SELOP12F25-30U-14 ➢ Process Gases Used: N2, C4F8, Ar, O2, CH2F2, CHF3, CF4, C4F8, C3F8, C4F6, He/O2OEM Model Description
Telius-SP is a high-performance etching system designed for large diameter (300 mm) requirements. It is part of the Telius platform and offers improved productivity through increased throughput, a reduced footprint, and higher energy efficiency. The system can be fitted with various chamber applications, including DRM and SCCM chambers, to support a wide range of process areas. It can support up to 4 chambers and boasts a high throughput, compact design, and low cost of ownership (CoO). Additionally, the system is designed for ease of maintenance. Overall, Telius-SP is a versatile and cost-effective solution for large diameter etching needs.Documents
No documents
Similar Listings
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