Description
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Cu Plating.OEM Model Description
The LT-210 is a single substrate processor that provides a fully automated platform for high throughput production of Cu Interconnect devices. It utilizes Semitool’s advanced electrochemical deposition technology to achieve this. The LT-210 is capable of electrochemical deposition (ECD) of materials such as Copper, Gold, and Solder for Cu Dual Damascene processes. This makes it an ideal tool for the production of high-quality interconnect devices.Documents
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SEMITOOL
LT-210
Verified
CATEGORY
Electro Plating
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
34499
Wafer Sizes:
Unknown
Vintage:
Unknown
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View AllSEMITOOL
LT-210
CATEGORY
Electro Plating
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
34499
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Cu Plating.OEM Model Description
The LT-210 is a single substrate processor that provides a fully automated platform for high throughput production of Cu Interconnect devices. It utilizes Semitool’s advanced electrochemical deposition technology to achieve this. The LT-210 is capable of electrochemical deposition (ECD) of materials such as Copper, Gold, and Solder for Cu Dual Damascene processes. This makes it an ideal tool for the production of high-quality interconnect devices.Documents
No documents