Overview

The LT-210 is a single substrate processor that provides a fully automated platform for high throughput production of Cu Interconnect devices. It utilizes Semitool’s advanced electrochemical deposition technology to achieve this. The LT-210 is capable of electrochemical deposition (ECD) of materials such as Copper, Gold, and Solder for Cu Dual Damascene processes. This makes it an ideal tool for the production of high-quality interconnect devices.