The Raider™ ECD is a fourth-generation single wafer electrochemical deposition tool that delivers advanced metal processing in a small footprint. It is an automated, multi-process tool that is available with cluster modules for metrology, plating, and cleaning. The Raider™ incorporates programmable reactors and can provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to provide advanced metal processing capabilities in a compact and efficient package. 

Semitool is supplies electrochemical plating and wafer surface preparation equipment used by chip packaging and chip making companies around the world.

APPLIED MATERIALS (AMAT) / SEMITOOL

RAIDER ECD

The Raider™ ECD310 is a fourth-generation, single-wafer, automated, multi-process electrochemical deposition tool. It delivers advanced metal processing in a small footprint and is available with cluster modules for metrology, plating, and cleaning. The Raider™ ECD310 incorporates programmable reactors that provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to deliver advanced metal processing capabilities in a compact package.

RAIDER ECD310

The Raider ECD is a system for 150mm-300mm single-wafer, automated, multi-chamber, electrochemical deposition that delivers high throughput in a small footprint. Electroplating on 300mm wafers employs an enhanced chamber reactor that is able to dynamically change the current density for unmatched uniformity. Some benefits of using the Raider ECD system include its ability to electroplate on ultra-thin and resistive seed layers through a multi-zone anode array. The system also saves on costs by using ionic membranes to extend chemistry life and “no teach” precision automation to eliminate automation re-teach down-time.

RAIDER ECD-312

The NOVELLUS SABRE xT is a tool used for electrofilling that is part of the second generation of SABRE tools. It is designed to provide void-free fill in 0.13-micron geometries with aspect ratios up to 10:1. The SABRE xT is a “bridge tool” that can process either 200 or 300 mm wafers. It incorporates process enhancements in the areas of electrical waveforms, advanced bath chemistries, and automated chemical monitoring and control using Novellus’ proprietary SmartDose algorithm. The SABRE xT can process up to 75 wafers per hour and has achieved within-wafer uniformity performance of less than 2% 1 sigma and wafer-to-wafer uniformity of less than 1% 1 sigma in a production environment.

Lam Research is a leading supplier of plasma etch- and single-wafer clean equipment that plays a pivotal role in defining the features and capabilities of next-generation semiconductor devices. With the addition of Novellus' innovative thin-film deposition and surface preparation product lines, the new Lam Research is well-positioned within the industry to support critical technology transitions including 3D structures in advanced logic and NAND memory, as well as the scaling to 450 mm wafers.

Electro Plating

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Manufacturers of Electro Plating

Top Products for Electro Plating

RAIDER ECD

RAIDER ECD310

RAIDER ECD-312

SABRE xT