Designed, developed & manufactured high performance and precision chemical processing equipment. Products included electrochemical deposition systems for electroplating copper, gold, solder and other metals; surface preparation systems for cleaning, stripping and etching silicon wafers; and wafer transport container cleaning systems.

The LT-210 is a single substrate processor that provides a fully automated platform for high throughput production of Cu Interconnect devices. It utilizes Semitool’s advanced electrochemical deposition technology to achieve this. The LT-210 is capable of electrochemical deposition (ECD) of materials such as Copper, Gold, and Solder for Cu Dual Damascene processes. This makes it an ideal tool for the production of high-quality interconnect devices.

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LT-210

The APx system is a single-wafer processor based on our linear automation technology. The tool is designed primarily for the wafer-level packaging market, where lower acquisition cost and flexibility are important. The architecture of the system allows the adaptation of electrochemical deposition and surface preparation chambers for automated or manual operation.

ACMS XT II

The LT210c is an advanced electrochemical deposition tool that delivers high throughput in a small footprint. It uses patented Capsule™ technology for superior copper fill and integrated removal of backside and bevel copper contamination. The tool is fully automated and can fill features as small as 0.08µm with superior purity and uniformity. It has a small footprint and offers fast installation, low cost of ownership, and high reliability. The LT210c can be used for a variety of applications including Copper Damascene, Nickel ECD, Solder ECD, Gold ECD, Platinum ECD, Copper Anneal, Tantalum Anodization (High-K), Patterned Copper, Gold ElectroEtch, ECD Seed Layer, and Thin Film Heads.

LT-210c

PARAGON

The Advanced Chemical Management System, or ACMS, is an automated electroplating bath control unit. It maintains the desired chemical balance in the plating baths by automatically analyzing and replenishing the chemical constituents using our proprietary technology. Fully integrated with the Company's ECD systems, the primary applications are copper and solder deposition.

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LT-210

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ACMS XT II

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