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PLASMATHERM 790
  • PLASMATHERM 790
  • PLASMATHERM 790
  • PLASMATHERM 790
  • PLASMATHERM 790
  • PLASMATHERM 790
  • PLASMATHERM 790
  • PLASMATHERM 790
Description
-Purchased 6 years ago as a refurbished tool -Installed and never ran, sat in the clean room for a few years -When they de-installed it they were able to successfully run the tool with no issues -currently in storage
Configuration
PECVD
OEM Model Description
The Plasma-Therm 790 series is a self-contained Reactive Ion Etching (RIE) system that features a showerhead gas distribution system and a water-cooled RF platen. This system is capable of etching silicon, silicon dioxide, and silicon nitride. The chamber can achieve a base pressure in the range of 3x10-5 Torr and can operate within a pressure range of 10mTorr to 100mTorr. The system is controlled by a PC and offers both manual and automatic operation modes. It has four process gases available: CF4, CHF3, SF6, and O2.
Documents

No documents

CATEGORY
Dry / Plasma Etch

Last Verified: 13 days ago

Key Item Details

Condition:

Used


Operational Status:

Deinstalled


Product ID:

111120


Wafer Sizes:

6"/150mm


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

PLASMATHERM

790

verified-listing-icon
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: 13 days ago
listing-photo-a443c4fc27ca45d7a1660c8a99e30abb-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/80668/a443c4fc27ca45d7a1660c8a99e30abb/0550d049fad840ebb42a8addf86177a9_1c6f2e05f0594a089e15473542089d841201a_mw.jpeg
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listing-photo-a443c4fc27ca45d7a1660c8a99e30abb-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/80668/a443c4fc27ca45d7a1660c8a99e30abb/a52d7632591c4cdb9cd27e8e89e91609_635512eb80fe4ea5ae4ddb4906516516_mw.jpeg
listing-photo-a443c4fc27ca45d7a1660c8a99e30abb-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/80668/a443c4fc27ca45d7a1660c8a99e30abb/46b937f7df0c4aca8730bc93c55ec41d_3f3a7146413f438091da0a76810f8dda1201a_mw.jpeg
listing-photo-a443c4fc27ca45d7a1660c8a99e30abb-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/80668/a443c4fc27ca45d7a1660c8a99e30abb/4fd44c9c580a4b0f9264d6e5989b2c91_ebf63973dc3d4f598f33cbe59e5fa614_mw.jpeg
Key Item Details

Condition:

Used


Operational Status:

Deinstalled


Product ID:

111120


Wafer Sizes:

6"/150mm


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
-Purchased 6 years ago as a refurbished tool -Installed and never ran, sat in the clean room for a few years -When they de-installed it they were able to successfully run the tool with no issues -currently in storage
Configuration
PECVD
OEM Model Description
The Plasma-Therm 790 series is a self-contained Reactive Ion Etching (RIE) system that features a showerhead gas distribution system and a water-cooled RF platen. This system is capable of etching silicon, silicon dioxide, and silicon nitride. The chamber can achieve a base pressure in the range of 3x10-5 Torr and can operate within a pressure range of 10mTorr to 100mTorr. The system is controlled by a PC and offers both manual and automatic operation modes. It has four process gases available: CF4, CHF3, SF6, and O2.
Documents

No documents