Description

No description

Configuration

PECVD

OEM Model Description

The Plasma-Therm 790 series is a self-contained Reactive Ion Etching (RIE) system that features a showerhead gas distribution system and a water-cooled RF platen. This system is capable of etching silicon, silicon dioxide, and silicon nitride. The chamber can achieve a base pressure in the range of 3x10-5 Torr and can operate within a pressure range of 10mTorr to 100mTorr. The system is controlled by a PC and offers both manual and automatic operation modes. It has four process gases available: CF4, CHF3, SF6, and O2.

Documents

No documents

PLASMATHERM

790

Verified

Dry / Plasma Etch

Last Verified: 10 days ago

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

145820

Wafer Sizes:

Unknown

Vintage:

Unknown

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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