790
Category
Dry / Plasma EtchOverview
The Plasma-Therm 790 series is a self-contained Reactive Ion Etching (RIE) system that features a showerhead gas distribution system and a water-cooled RF platen. This system is capable of etching silicon, silicon dioxide, and silicon nitride. The chamber can achieve a base pressure in the range of 3x10-5 Torr and can operate within a pressure range of 10mTorr to 100mTorr. The system is controlled by a PC and offers both manual and automatic operation modes. It has four process gases available: CF4, CHF3, SF6, and O2.
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PLASMATHERM
790
Dry / Plasma EtchVintage: Condition: UsedLast Verified14 days agoPLASMATHERM
790
Dry / Plasma EtchVintage: 1993Condition: UsedLast Verified22 days agoPLASMATHERM
790
Dry / Plasma EtchVintage: Condition: RefurbishedLast VerifiedOver 60 days agoPLASMATHERM
790
Dry / Plasma EtchVintage: Condition: RefurbishedLast VerifiedOver 60 days ago
PLASMATHERM
790
Dry / Plasma EtchVintage: Condition: UsedLast VerifiedOver 60 days agoPLASMATHERM
790
Dry / Plasma EtchVintage: Condition: UsedLast VerifiedOver 60 days agoPLASMATHERM
790
Dry / Plasma EtchVintage: Condition: UsedLast VerifiedOver 60 days agoPLASMATHERM
790
Dry / Plasma EtchVintage: Condition: UsedLast VerifiedOver 60 days ago