Description
KLA-Tencor Candela CS20 Optical Defect InspectionConfiguration
Wafer Size : 2 ~8 inch Illumination Source : 8mW laser, 635 nm wavelength Operator Interface : Trackball and keyboard standard Substrate Thickness : 350 μm ~ 1,100 μm Substrate Material : Any clear or opaque polished surface [ Performance ] Defect Sensitivity 0.08 μm diameter PSL sphere equivalent > 95% capture rate(PSL on bare Si) Other Defects and Applications : Particles, scratches, stains, pits, and bumps. Sensitivity: Minimum detectable size for automatic defect classification: - Scratches: 100 μm long, 0.1 μm wide, 50 Å; deep. - Pits: 20 μm diameter, 50 Å; deep - Stains: 20 μm diameter, 10 Å; thick [ Application ] - Opaque substrates - EPI Layers - Transparent film coatings (SiC, GaN, SapphireOEM Model Description
The Candela CS20 system measures surface reflectivity and topography for automatic defect detection and classification. It uses scatterometry, ellipsometry, reflectometry, and topographical analysis to inspect wafer surfaces for defects and film thickness uniformity. It is designed for inspection of transparent materials such as sapphire and GaN and can detect a wide variety of defects. It is suitable for use in the production of High Brightness Light Emitting Diodes (HBLEDs), High-Power RF Devices, and Coated Glass (CMOS imagers, LCoS chips, etc.).Documents
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KLA
CANDELA CS20
Verified
CATEGORY
Defect Inspection
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
101990
Wafer Sizes:
6"/150mm
Vintage:
2006
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Logistics Support
Available
Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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KLA
CANDELA CS20
Verified
CATEGORY
Defect Inspection
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
101990
Wafer Sizes:
6"/150mm
Vintage:
2006
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
KLA-Tencor Candela CS20 Optical Defect InspectionConfiguration
Wafer Size : 2 ~8 inch Illumination Source : 8mW laser, 635 nm wavelength Operator Interface : Trackball and keyboard standard Substrate Thickness : 350 μm ~ 1,100 μm Substrate Material : Any clear or opaque polished surface [ Performance ] Defect Sensitivity 0.08 μm diameter PSL sphere equivalent > 95% capture rate(PSL on bare Si) Other Defects and Applications : Particles, scratches, stains, pits, and bumps. Sensitivity: Minimum detectable size for automatic defect classification: - Scratches: 100 μm long, 0.1 μm wide, 50 Å; deep. - Pits: 20 μm diameter, 50 Å; deep - Stains: 20 μm diameter, 10 Å; thick [ Application ] - Opaque substrates - EPI Layers - Transparent film coatings (SiC, GaN, SapphireOEM Model Description
The Candela CS20 system measures surface reflectivity and topography for automatic defect detection and classification. It uses scatterometry, ellipsometry, reflectometry, and topographical analysis to inspect wafer surfaces for defects and film thickness uniformity. It is designed for inspection of transparent materials such as sapphire and GaN and can detect a wide variety of defects. It is suitable for use in the production of High Brightness Light Emitting Diodes (HBLEDs), High-Power RF Devices, and Coated Glass (CMOS imagers, LCoS chips, etc.).Documents
No documents