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SHINKAWA UTC 1000 SUPER
  • SHINKAWA UTC 1000 SUPER
  • SHINKAWA UTC 1000 SUPER
Description
No description
Configuration
No Configuration
OEM Model Description
The UTC-1000 Super wire bonder is a high-speed wire bonder that is compatible with SiP including stacked CSP. It is designed for bonding CSP, BGA, Small Substrate, and Lead Frame Type ICs. The UTC-1000 Super wire bonder is equipped with Shinkawa RPS technology, which is the world’s first capillary tip position closed-loop control that solves fine-pitch bonding misalignment and supports 40μm pad-pitch bonding. The Shinkawa NRS technology reduces vibration that hinders fine-pitch bonding and ensures stable bondability. The UTC-1000 Super wire bonder has various loop modes that are ideal for bonding stacked dies as standard. It also has numerous automatic functions that reduce the burden on the operator
Documents

No documents

CATEGORY
Wire / Wedge / Ball Bonder

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

58638


Wafer Sizes:

Unknown


Vintage:

2005


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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SHINKAWA

UTC 1000 SUPER

verified-listing-icon
Verified
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
listing-photo-a56f05d32a834a0dba02c591e188b881-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1980/a56f05d32a834a0dba02c591e188b881/7b7279b3b48840449a3a4ca1d506912b_2bddf33801094630aaed99b668680cfa45005c_mw.jpeg
listing-photo-a56f05d32a834a0dba02c591e188b881-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1980/a56f05d32a834a0dba02c591e188b881/192dc26c3f3b446bb54c613d37558b3c_d90cee36bf694c2a82e823cd196d161945005c_mw.jpeg
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

58638


Wafer Sizes:

Unknown


Vintage:

2005


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No description
Configuration
No Configuration
OEM Model Description
The UTC-1000 Super wire bonder is a high-speed wire bonder that is compatible with SiP including stacked CSP. It is designed for bonding CSP, BGA, Small Substrate, and Lead Frame Type ICs. The UTC-1000 Super wire bonder is equipped with Shinkawa RPS technology, which is the world’s first capillary tip position closed-loop control that solves fine-pitch bonding misalignment and supports 40μm pad-pitch bonding. The Shinkawa NRS technology reduces vibration that hinders fine-pitch bonding and ensures stable bondability. The UTC-1000 Super wire bonder has various loop modes that are ideal for bonding stacked dies as standard. It also has numerous automatic functions that reduce the burden on the operator
Documents

No documents

Similar Listings
View All