Description
No descriptionConfiguration
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The UTC-1000 Super wire bonder is a high-speed wire bonder that is compatible with SiP including stacked CSP. It is designed for bonding CSP, BGA, Small Substrate, and Lead Frame Type ICs. The UTC-1000 Super wire bonder is equipped with Shinkawa RPS technology, which is the world’s first capillary tip position closed-loop control that solves fine-pitch bonding misalignment and supports 40μm pad-pitch bonding. The Shinkawa NRS technology reduces vibration that hinders fine-pitch bonding and ensures stable bondability. The UTC-1000 Super wire bonder has various loop modes that are ideal for bonding stacked dies as standard. It also has numerous automatic functions that reduce the burden on the operatorDocuments
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SHINKAWA
UTC 1000 SUPER
Verified
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: 10 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
118798
Wafer Sizes:
8"/200mm
Vintage:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
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Refurbishment Services
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Wire / Wedge / Ball BonderVintage: 2006Condition: Used
Last Verified10 days ago
SHINKAWA
UTC 1000 SUPER
Wire / Wedge / Ball BonderVintage: 2006Condition: Used
Last Verified10 days ago
SHINKAWA
UTC 1000 SUPER
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: 10 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
118798
Wafer Sizes:
8"/200mm
Vintage:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The UTC-1000 Super wire bonder is a high-speed wire bonder that is compatible with SiP including stacked CSP. It is designed for bonding CSP, BGA, Small Substrate, and Lead Frame Type ICs. The UTC-1000 Super wire bonder is equipped with Shinkawa RPS technology, which is the world’s first capillary tip position closed-loop control that solves fine-pitch bonding misalignment and supports 40μm pad-pitch bonding. The Shinkawa NRS technology reduces vibration that hinders fine-pitch bonding and ensures stable bondability. The UTC-1000 Super wire bonder has various loop modes that are ideal for bonding stacked dies as standard. It also has numerous automatic functions that reduce the burden on the operatorDocuments
No documents