Description
Au Plating, Au Etch and Au DeplatingConfiguration
No ConfigurationOEM Model Description
From its inception to the first delivery in 2013, the Triton platform was designed to be a stable but modular workhorse for all single-wafer wet-processes. The modular build of our tools enables our customer to configure the tool for a mass-production single-process tool as well as a swiss-army knife R&D or prototyping tool – without affecting performance or reliability. -Processing of 3” to 450 mm substrates -Possibility of processing two to three different substrate sizes with minimal or no reconfiguration – and no requalification of the chamber -Patented High-Speed Plating for better throughput and better uniformity – without changing the chemistryDocuments
No documents
SEMSYSCO
TRITON
Verified
CATEGORY
Wet processing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
83268
Wafer Sizes:
Unknown
Vintage:
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SEMSYSCO
TRITON
CATEGORY
Wet processing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
83268
Wafer Sizes:
Unknown
Vintage:
2018
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Au Plating, Au Etch and Au DeplatingConfiguration
No ConfigurationOEM Model Description
From its inception to the first delivery in 2013, the Triton platform was designed to be a stable but modular workhorse for all single-wafer wet-processes. The modular build of our tools enables our customer to configure the tool for a mass-production single-process tool as well as a swiss-army knife R&D or prototyping tool – without affecting performance or reliability. -Processing of 3” to 450 mm substrates -Possibility of processing two to three different substrate sizes with minimal or no reconfiguration – and no requalification of the chamber -Patented High-Speed Plating for better throughput and better uniformity – without changing the chemistryDocuments
No documents