Description
Wafer Grinding Grinder /Grinder (8GD-3)Configuration
Main unit: 1200mm(W) X 2670mm(D) X 1800mm(H) / 3100kg Auxiliary machines: Vacuum unit : 500mm (W) X 815mm (D) X 670mm (H) / 75kg transformer: 500(W)mm X 500mm (D) X 500 (H)mm / 60kgOEM Model Description
The Disco DFG8540 is a fully automatic in-feed surface grinder. It has a conventional two-spindle, three-chuck design and is capable of performing both large diameter and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance. The Disco DFG8540 supports workpiece sizes up to Φ8 inch and uses a Φ200 mm Diamond Wheel for grinding. The spindle has a rated output of 4.2 kW and a rotation speed range of 1,000 to 7,000 min-1. The equipment dimensions are 1,200 × 2,670 × 1,800 mm and it weighs approximately 3,100 kg.Documents
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DISCO
DFG8540
CATEGORY
Wafer Grinding
Last Verified: 25 days ago
Key Item Details
Condition:
Used
Operational Status:
Installed / Running
Product ID:
140505
Wafer Sizes:
6"/150mm, 8"/200mm
Vintage:
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available