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6" Fab For Sale from Moov - Click Here to Learn More
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DISCO DFG8540
    Description
    Grinder thinning machine
    Configuration
    No Configuration
    OEM Model Description
    The Disco DFG8540 is a fully automatic in-feed surface grinder. It has a conventional two-spindle, three-chuck design and is capable of performing both large diameter and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance. The Disco DFG8540 supports workpiece sizes up to Φ8 inch and uses a Φ200 mm Diamond Wheel for grinding. The spindle has a rated output of 4.2 kW and a rotation speed range of 1,000 to 7,000 min-1. The equipment dimensions are 1,200 × 2,670 × 1,800 mm and it weighs approximately 3,100 kg.
    Documents

    No documents

    DISCO

    DFG8540

    verified-listing-icon

    Verified

    CATEGORY
    Wafer Grinding

    Last Verified: 15 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    79145


    Wafer Sizes:

    8"/200mm


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    DISCO DFG8540

    DISCO

    DFG8540

    Wafer Grinding
    Vintage: 2015Condition: Used
    Last VerifiedOver 60 days ago

    DISCO

    DFG8540

    verified-listing-icon
    Verified
    CATEGORY
    Wafer Grinding
    Last Verified: 15 days ago
    listing-photo-6a2d165a91264e2f836ce0de6d19bc09-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1955/6a2d165a91264e2f836ce0de6d19bc09/c661c112b8784af498172821160aa98b_screenshot20240904185346_mw.png
    listing-photo-6a2d165a91264e2f836ce0de6d19bc09-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1955/6a2d165a91264e2f836ce0de6d19bc09/acb2d7dbe55a474d8ebe66ada8c636c6_screenshot20240904185359_mw.png
    listing-photo-6a2d165a91264e2f836ce0de6d19bc09-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1955/6a2d165a91264e2f836ce0de6d19bc09/7c82ea3fe4f4429b952df8f649c87c8f_screenshot20240904185408_mw.png
    listing-photo-6a2d165a91264e2f836ce0de6d19bc09-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1955/6a2d165a91264e2f836ce0de6d19bc09/8cfd1ade59b94f95a85d239e474f4797_screenshot20240904185419_mw.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    79145


    Wafer Sizes:

    8"/200mm


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Grinder thinning machine
    Configuration
    No Configuration
    OEM Model Description
    The Disco DFG8540 is a fully automatic in-feed surface grinder. It has a conventional two-spindle, three-chuck design and is capable of performing both large diameter and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance. The Disco DFG8540 supports workpiece sizes up to Φ8 inch and uses a Φ200 mm Diamond Wheel for grinding. The spindle has a rated output of 4.2 kW and a rotation speed range of 1,000 to 7,000 min-1. The equipment dimensions are 1,200 × 2,670 × 1,800 mm and it weighs approximately 3,100 kg.
    Documents

    No documents

    Similar Listings
    View All
    DISCO DFG8540

    DISCO

    DFG8540

    Wafer GrindingVintage: 2015Condition: UsedLast Verified:Over 60 days ago
    DISCO DFG8540

    DISCO

    DFG8540

    Wafer GrindingVintage: 2007Condition: UsedLast Verified:Over 60 days ago
    DISCO DFG8540

    DISCO

    DFG8540

    Wafer GrindingVintage: 0Condition: UsedLast Verified:Over 60 days ago