Description
Slicer Fully automatic grinder. This equipment operates reliably and is suitable for grinding semiconductor materials. Equipped with the original control system and safety guard, featuring a touchscreen interface. Spindle rated power: 4.2 kW; rated torque: 5.9 N·m; speed range: 1,000 to 7,000 min⁻¹.Configuration
No ConfigurationOEM Model Description
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.Documents
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DISCO
DAG810
CATEGORY
Wafer Grinding
Last Verified: 13 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
140557
Wafer Sizes:
Unknown
Vintage:
2016
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Slicer Fully automatic grinder. This equipment operates reliably and is suitable for grinding semiconductor materials. Equipped with the original control system and safety guard, featuring a touchscreen interface. Spindle rated power: 4.2 kW; rated torque: 5.9 N·m; speed range: 1,000 to 7,000 min⁻¹.Configuration
No ConfigurationOEM Model Description
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.Documents
No documents