Description
Diffusion (NIT ） Manufacturer: TEL Model: FORMULA S/W Version 2.0Configuration
Please see attached configurationOEM Model Description
TELFORMULA is an advanced thermal processing system designed for the production of 65 to 45-nm-node-generation devices and beyond. It offers a reasonable Cost of Ownership (CoO), a short cycle time, and significantly improved process performance. Some of its key features include an ultra-clean, all-quartz reactor, state-of-the-art heater element technology, high-speed wafer-transfer robotics, and in-situ dry gas cleaning technology. TELFORMULA has a wide range of applications, including radical oxidation (LPRO), ultra-thin gate dielectrics formation (oxidation, nitridation), LPCVD (supporting Poly, Sin, SiO2 / Dry gas cleaning), ultra-low temperature LPCVD, and high-k film formation (AIO, HfO, AIO / HfO, HfSiO). With its advanced technology and versatile capabilities, TELFORMULA is an optimal choice for thermal processing in the semiconductor industry.Documents
TEL / TOKYO ELECTRON
TELFORMULA
Verified
CATEGORY
Thermal Processing
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
78758
Wafer Sizes:
12"/300mm
Vintage:
2007
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
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Refurbishment Services
Available
TEL / TOKYO ELECTRON
TELFORMULA
Verified
CATEGORY
Thermal Processing
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
78758
Wafer Sizes:
12"/300mm
Vintage:
2007
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Diffusion (NIT ） Manufacturer: TEL Model: FORMULA S/W Version 2.0Configuration
Please see attached configurationOEM Model Description
TELFORMULA is an advanced thermal processing system designed for the production of 65 to 45-nm-node-generation devices and beyond. It offers a reasonable Cost of Ownership (CoO), a short cycle time, and significantly improved process performance. Some of its key features include an ultra-clean, all-quartz reactor, state-of-the-art heater element technology, high-speed wafer-transfer robotics, and in-situ dry gas cleaning technology. TELFORMULA has a wide range of applications, including radical oxidation (LPRO), ultra-thin gate dielectrics formation (oxidation, nitridation), LPCVD (supporting Poly, Sin, SiO2 / Dry gas cleaning), ultra-low temperature LPCVD, and high-k film formation (AIO, HfO, AIO / HfO, HfSiO). With its advanced technology and versatile capabilities, TELFORMULA is an optimal choice for thermal processing in the semiconductor industry.Documents
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