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TEL / TOKYO ELECTRON TELFORMULA
    Description
    No description
    Configuration
    Poly 1 Description: Diffusion(Amorphous Anneal, ɑ-Si) Manufacturer: TEL Model: FORMULA S/W Version 2.0 Configuration: < Basic Configuration > Thoroughput: 50 wafers in Batch Temperature: 850℃ Gas Unit: PH3 1% ,F2, H2, O2 , System Controller: WAVES/Model780 Heater: Mid-Temp VCM-50-XXX Exhaust Controller: CKD VEC EXH Box: Standard Type (190 cm width ) Dry Pump: Exclude < Gas Configuration > Gas Pressure Flow Connection Type Gas Box P-N2 0.5MPa 92 L/min φ1/4”UJR 1%PH3/He 0.2MPa 5 L/min φ1/4”UJR H2 0.2MPa 5 L/min φ1/4”UJR O2 0.2MPa 5 L/min φ1/4”UJR F2 0.2MPa 5 L/min φ1/4”UJR EXH Box P-N2 - - φ3/4”SWG P-N2 - - φ1/2”SWG P-N2 - - φ1/2”SWG D-N2 - - φ3/8”SWG D-N2 - - φ3/8”SWG D-N2 - - φ1/4”SWG Vacuum 20KPa - φ3/8”SWG RCU P-N2 0.7MPa 1200 L/Min φ3/4”SWG D-N2 0.7MPa - φ1/4”SWG P-N2 - - φ3/4”SWG P-N2 - - φ1/2”SWG P-N2 - - φ1/2”SWG D-N2 - - φ3/8”SWG D-N2 - - φ3/8”SWG D-N2 - - φ1/4”SWG Pump D-N2 0.7MPa - φ1/4”SWG D-N2 0.7MPa 110 L/min φ1/2”SWG
    OEM Model Description
    TELFORMULA is an advanced thermal processing system designed for the production of 65 to 45-nm-node-generation devices and beyond. It offers a reasonable Cost of Ownership (CoO), a short cycle time, and significantly improved process performance. Some of its key features include an ultra-clean, all-quartz reactor, state-of-the-art heater element technology, high-speed wafer-transfer robotics, and in-situ dry gas cleaning technology. TELFORMULA has a wide range of applications, including radical oxidation (LPRO), ultra-thin gate dielectrics formation (oxidation, nitridation), LPCVD (supporting Poly, Sin, SiO2 / Dry gas cleaning), ultra-low temperature LPCVD, and high-k film formation (AIO, HfO, AIO / HfO, HfSiO). With its advanced technology and versatile capabilities, TELFORMULA is an optimal choice for thermal processing in the semiconductor industry.
    Documents
    verified-listing-icon

    Verified

    CATEGORY
    Furnaces / Diffusion

    Last Verified: 26 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    129313


    Wafer Sizes:

    12"/300mm


    Vintage:

    2009


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
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    TEL / TOKYO ELECTRON TELFORMULA

    TEL / TOKYO ELECTRON

    TELFORMULA

    Furnaces / Diffusion
    Vintage: 0Condition: Used
    Last Verified19 days ago

    TEL / TOKYO ELECTRON

    TELFORMULA

    verified-listing-icon
    Verified
    CATEGORY
    Furnaces / Diffusion
    Last Verified: 26 days ago
    listing-photo-09114cc66fd74ee39f79efce0ceebe8c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73363/09114cc66fd74ee39f79efce0ceebe8c/c74a229f4f45433c8aab179a9eebcbb3_formulapage4image0002_mw.jpg
    listing-photo-09114cc66fd74ee39f79efce0ceebe8c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73363/09114cc66fd74ee39f79efce0ceebe8c/b330bc15850e43d7bab516a8a840488c_formulapage3image0002_mw.jpg
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    listing-photo-09114cc66fd74ee39f79efce0ceebe8c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73363/09114cc66fd74ee39f79efce0ceebe8c/3943daf0a62e44fea05b5cdaa3ea7de4_formulapage3image0001_mw.jpg
    listing-photo-09114cc66fd74ee39f79efce0ceebe8c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73363/09114cc66fd74ee39f79efce0ceebe8c/b9c9c0f806154c5b8df77b1a8dbcbd18_formulapage2image0001_mw.jpg
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    129313


    Wafer Sizes:

    12"/300mm


    Vintage:

    2009


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    Poly 1 Description: Diffusion(Amorphous Anneal, ɑ-Si) Manufacturer: TEL Model: FORMULA S/W Version 2.0 Configuration: < Basic Configuration > Thoroughput: 50 wafers in Batch Temperature: 850℃ Gas Unit: PH3 1% ,F2, H2, O2 , System Controller: WAVES/Model780 Heater: Mid-Temp VCM-50-XXX Exhaust Controller: CKD VEC EXH Box: Standard Type (190 cm width ) Dry Pump: Exclude < Gas Configuration > Gas Pressure Flow Connection Type Gas Box P-N2 0.5MPa 92 L/min φ1/4”UJR 1%PH3/He 0.2MPa 5 L/min φ1/4”UJR H2 0.2MPa 5 L/min φ1/4”UJR O2 0.2MPa 5 L/min φ1/4”UJR F2 0.2MPa 5 L/min φ1/4”UJR EXH Box P-N2 - - φ3/4”SWG P-N2 - - φ1/2”SWG P-N2 - - φ1/2”SWG D-N2 - - φ3/8”SWG D-N2 - - φ3/8”SWG D-N2 - - φ1/4”SWG Vacuum 20KPa - φ3/8”SWG RCU P-N2 0.7MPa 1200 L/Min φ3/4”SWG D-N2 0.7MPa - φ1/4”SWG P-N2 - - φ3/4”SWG P-N2 - - φ1/2”SWG P-N2 - - φ1/2”SWG D-N2 - - φ3/8”SWG D-N2 - - φ3/8”SWG D-N2 - - φ1/4”SWG Pump D-N2 0.7MPa - φ1/4”SWG D-N2 0.7MPa 110 L/min φ1/2”SWG
    OEM Model Description
    TELFORMULA is an advanced thermal processing system designed for the production of 65 to 45-nm-node-generation devices and beyond. It offers a reasonable Cost of Ownership (CoO), a short cycle time, and significantly improved process performance. Some of its key features include an ultra-clean, all-quartz reactor, state-of-the-art heater element technology, high-speed wafer-transfer robotics, and in-situ dry gas cleaning technology. TELFORMULA has a wide range of applications, including radical oxidation (LPRO), ultra-thin gate dielectrics formation (oxidation, nitridation), LPCVD (supporting Poly, Sin, SiO2 / Dry gas cleaning), ultra-low temperature LPCVD, and high-k film formation (AIO, HfO, AIO / HfO, HfSiO). With its advanced technology and versatile capabilities, TELFORMULA is an optimal choice for thermal processing in the semiconductor industry.
    Documents
    Similar Listings
    View All
    TEL / TOKYO ELECTRON TELFORMULA

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    TEL / TOKYO ELECTRON TELFORMULA

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