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ACCRETECH / TSK A-WD-200T
  • ACCRETECH / TSK A-WD-200T
  • ACCRETECH / TSK A-WD-200T
Description
No description
Configuration
No Configuration
OEM Model Description
The A-WD-200T is the first twin-spindle dicer for 200mm wafers. The A-WD-200T is a wafer dicing machine that features a face-to-face, twin-spindle arrangement and X-axis acceleration for outstanding throughput. The machine is equipped with a linear motor in the X-axis mechanism that enhances dicing quality by minimizing vibration. The color LCD touch-panel operation screen is easy to understand and convenient to use. Additionally, the X-axis drive mechanism is now entirely contact- and maintenance-free, making it a reliable and efficient choice for wafer dicing operations.
Documents

No documents

ACCRETECH / TSK

A-WD-200T

verified-listing-icon

Verified

CATEGORY
Scribing, Cutting, Dicing

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

25735


Wafer Sizes:

Unknown


Vintage:

2004


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ACCRETECH / TSK

A-WD-200T

verified-listing-icon
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
listing-photo-e09ce5c7e3d94243bf90a29c0b47ab58-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/40372/e09ce5c7e3d94243bf90a29c0b47ab58/adaf73b898fd4022a0f5e7f89ab83628_576881d43f82453582904d6da7790b8045005c_f.jpeg
listing-photo-e09ce5c7e3d94243bf90a29c0b47ab58-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/40372/e09ce5c7e3d94243bf90a29c0b47ab58/be53bdac36524f2fbaa93199235d2886_b1dbc5aefe0342fb9ca7e3496979172145005c_f.jpeg
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

25735


Wafer Sizes:

Unknown


Vintage:

2004


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No description
Configuration
No Configuration
OEM Model Description
The A-WD-200T is the first twin-spindle dicer for 200mm wafers. The A-WD-200T is a wafer dicing machine that features a face-to-face, twin-spindle arrangement and X-axis acceleration for outstanding throughput. The machine is equipped with a linear motor in the X-axis mechanism that enhances dicing quality by minimizing vibration. The color LCD touch-panel operation screen is easy to understand and convenient to use. Additionally, the X-axis drive mechanism is now entirely contact- and maintenance-free, making it a reliable and efficient choice for wafer dicing operations.
Documents

No documents

Similar Listings
View All