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6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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ACCRETECH / TSK A-WD-200T
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The A-WD-200T is the first twin-spindle dicer for 200mm wafers. The A-WD-200T is a wafer dicing machine that features a face-to-face, twin-spindle arrangement and X-axis acceleration for outstanding throughput. The machine is equipped with a linear motor in the X-axis mechanism that enhances dicing quality by minimizing vibration. The color LCD touch-panel operation screen is easy to understand and convenient to use. Additionally, the X-axis drive mechanism is now entirely contact- and maintenance-free, making it a reliable and efficient choice for wafer dicing operations.
    Documents

    No documents

    ACCRETECH / TSK

    A-WD-200T

    verified-listing-icon

    Verified

    CATEGORY
    Scribing, Cutting, Dicing

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    25735


    Wafer Sizes:

    Unknown


    Vintage:

    2004


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    ACCRETECH / TSK A-WD-200T

    ACCRETECH / TSK

    A-WD-200T

    Scribing, Cutting, Dicing
    Vintage: 2004Condition: Used
    Last VerifiedOver 60 days ago

    ACCRETECH / TSK

    A-WD-200T

    verified-listing-icon
    Verified
    CATEGORY
    Scribing, Cutting, Dicing
    Last Verified: Over 60 days ago
    listing-photo-e09ce5c7e3d94243bf90a29c0b47ab58-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/40372/e09ce5c7e3d94243bf90a29c0b47ab58/adaf73b898fd4022a0f5e7f89ab83628_576881d43f82453582904d6da7790b8045005c_f.jpeg
    listing-photo-e09ce5c7e3d94243bf90a29c0b47ab58-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/40372/e09ce5c7e3d94243bf90a29c0b47ab58/be53bdac36524f2fbaa93199235d2886_b1dbc5aefe0342fb9ca7e3496979172145005c_f.jpeg
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    25735


    Wafer Sizes:

    Unknown


    Vintage:

    2004


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The A-WD-200T is the first twin-spindle dicer for 200mm wafers. The A-WD-200T is a wafer dicing machine that features a face-to-face, twin-spindle arrangement and X-axis acceleration for outstanding throughput. The machine is equipped with a linear motor in the X-axis mechanism that enhances dicing quality by minimizing vibration. The color LCD touch-panel operation screen is easy to understand and convenient to use. Additionally, the X-axis drive mechanism is now entirely contact- and maintenance-free, making it a reliable and efficient choice for wafer dicing operations.
    Documents

    No documents

    Similar Listings
    View All
    ACCRETECH / TSK A-WD-200T

    ACCRETECH / TSK

    A-WD-200T

    Scribing, Cutting, DicingVintage: 2004Condition: UsedLast Verified:Over 60 days ago
    ACCRETECH / TSK A-WD-200T

    ACCRETECH / TSK

    A-WD-200T

    Scribing, Cutting, DicingVintage: 2006Condition: UsedLast Verified:Over 60 days ago
    ACCRETECH / TSK A-WD-200T

    ACCRETECH / TSK

    A-WD-200T

    Scribing, Cutting, DicingVintage: 2001Condition: UsedLast Verified:Over 60 days ago