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ACCRETECH / TSK A-WD-200T
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The A-WD-200T is the first twin-spindle dicer for 200mm wafers. The A-WD-200T is a wafer dicing machine that features a face-to-face, twin-spindle arrangement and X-axis acceleration for outstanding throughput. The machine is equipped with a linear motor in the X-axis mechanism that enhances dicing quality by minimizing vibration. The color LCD touch-panel operation screen is easy to understand and convenient to use. Additionally, the X-axis drive mechanism is now entirely contact- and maintenance-free, making it a reliable and efficient choice for wafer dicing operations.
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    ACCRETECH / TSK

    A-WD-200T

    verified-listing-icon

    Verified

    CATEGORY

    Scribing, Cutting, Dicing
    Last Verified: Over 60 days ago
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    25750


    Wafer Sizes:

    Unknown


    Vintage:

    2004

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    Transaction Insured by Moov
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    Similar Listings
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    ACCRETECH / TSK A-WD-200T
    ACCRETECH / TSKA-WD-200TScribing, Cutting, Dicing
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    ACCRETECH / TSK

    A-WD-200T

    verified-listing-icon

    Verified

    CATEGORY

    Scribing, Cutting, Dicing
    Last Verified: Over 60 days ago
    listing-photo-cdd41af17340488798bd14340daa4bd5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/40372/cdd41af17340488798bd14340daa4bd5/68e472062f3a4ebd80c6a99b80cdacb3_7a130430dbe74ba0a4b1de8504f67c5745005c_f.jpeg
    listing-photo-cdd41af17340488798bd14340daa4bd5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/40372/cdd41af17340488798bd14340daa4bd5/51e6ab2f912447ea92ed23e5357eefc9_5c053f8d52454794baf5d0a9d41862c845005c_f.jpeg
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    25750


    Wafer Sizes:

    Unknown


    Vintage:

    2004


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The A-WD-200T is the first twin-spindle dicer for 200mm wafers. The A-WD-200T is a wafer dicing machine that features a face-to-face, twin-spindle arrangement and X-axis acceleration for outstanding throughput. The machine is equipped with a linear motor in the X-axis mechanism that enhances dicing quality by minimizing vibration. The color LCD touch-panel operation screen is easy to understand and convenient to use. Additionally, the X-axis drive mechanism is now entirely contact- and maintenance-free, making it a reliable and efficient choice for wafer dicing operations.
    Documents

    No documents

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    View All
    ACCRETECH / TSK A-WD-200T
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    Scribing, Cutting, DicingVintage: 2013Condition: UsedLast Verified: Over 60 days ago