Skip to main content
ACCRETECH / TSK A-WD-200T
    Have one like this?Sell it with Moov
    Key Item Details

    Condition:Used

    Operational Status:

    Product ID:25753

    Wafer Sizes:Unknown

    Vintage:2006

    Description

    No description available

    Configuration

    No Configuration

    Documents
    No documents
    OEM Model Description

    The A-WD-200T is the first twin-spindle dicer for 200mm wafers. The A-WD-200T is a wafer dicing machine that features a face-to-face, twin-spindle arrangement and X-axis acceleration for outstanding throughput. The machine is equipped with a linear motor in the X-axis mechanism that enhances dicing quality by minimizing vibration. The color LCD touch-panel operation screen is easy to understand and convenient to use. Additionally, the X-axis drive mechanism is now entirely contact- and maintenance-free, making it a reliable and efficient choice for wafer dicing operations.

    Available Services

    Moov goes beyond the transaction to ensure a seamless buying experience from start to finish.

    • Money Back Guarantee

      Now free!

      Let Moov take the risk out of purchasing secondhand equipment with our 'No questions asked Money Back Guarantee' Learn more

    • Logistics

      One stop shop for Moov-ing equipment anywhere globally.

    • Insurance

      Moov-ing equipment can be risky. Let us take on that risk so you can relax while your equipment is in transit.

    • Refurbishment

      Need a tool built to the required specifications? Moov's refurbishment team has over 20 years of experience.