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ACCRETECH / TSK A-WD-200T
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The A-WD-200T is the first twin-spindle dicer for 200mm wafers. The A-WD-200T is a wafer dicing machine that features a face-to-face, twin-spindle arrangement and X-axis acceleration for outstanding throughput. The machine is equipped with a linear motor in the X-axis mechanism that enhances dicing quality by minimizing vibration. The color LCD touch-panel operation screen is easy to understand and convenient to use. Additionally, the X-axis drive mechanism is now entirely contact- and maintenance-free, making it a reliable and efficient choice for wafer dicing operations.
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    ACCRETECH / TSK

    A-WD-200T

    verified-listing-icon

    Verified

    CATEGORY

    Scribing, Cutting, Dicing
    Last Verified: Over 60 days ago
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    25746


    Wafer Sizes:

    Unknown


    Vintage:

    2003

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    Transaction Insured by Moov
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    Similar Listings
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    ACCRETECH / TSK A-WD-200T
    ACCRETECH / TSKA-WD-200TScribing, Cutting, Dicing
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    ACCRETECH / TSK

    A-WD-200T

    verified-listing-icon

    Verified

    CATEGORY

    Scribing, Cutting, Dicing
    Last Verified: Over 60 days ago
    listing-photo-b3fca5ff459c43cab103d12e58cd5267-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/40372/b3fca5ff459c43cab103d12e58cd5267/234ea8a292c247e0879d29bf3f390c8c_38fe4fb22e65438e8fafc7818abedfb145005c_f.jpeg
    listing-photo-b3fca5ff459c43cab103d12e58cd5267-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/40372/b3fca5ff459c43cab103d12e58cd5267/90ff85bcf0fd465ca0ac0d220f04b5c0_c1a0f09748d242c4b106b794338e702a45005c_f.jpeg
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    25746


    Wafer Sizes:

    Unknown


    Vintage:

    2003


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The A-WD-200T is the first twin-spindle dicer for 200mm wafers. The A-WD-200T is a wafer dicing machine that features a face-to-face, twin-spindle arrangement and X-axis acceleration for outstanding throughput. The machine is equipped with a linear motor in the X-axis mechanism that enhances dicing quality by minimizing vibration. The color LCD touch-panel operation screen is easy to understand and convenient to use. Additionally, the X-axis drive mechanism is now entirely contact- and maintenance-free, making it a reliable and efficient choice for wafer dicing operations.
    Documents

    No documents

    Similar Listings
    View All
    ACCRETECH / TSK A-WD-200T
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    ACCRETECH / TSK A-WD-200T
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    Scribing, Cutting, DicingVintage: 2013Condition: UsedLast Verified: Over 60 days ago