Description

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OEM Model Description

The A-WD-200T is the first twin-spindle dicer for 200mm wafers. The A-WD-200T is a wafer dicing machine that features a face-to-face, twin-spindle arrangement and X-axis acceleration for outstanding throughput. The machine is equipped with a linear motor in the X-axis mechanism that enhances dicing quality by minimizing vibration. The color LCD touch-panel operation screen is easy to understand and convenient to use. Additionally, the X-axis drive mechanism is now entirely contact- and maintenance-free, making it a reliable and efficient choice for wafer dicing operations.

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ACCRETECH / TSK

A-WD-200T

Verified

Scribing, Cutting, Dicing

Last Verified: Today

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

119559

Wafer Sizes:

Unknown

Vintage:

2000

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