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ACCRETECH / TSK A-WD-200T
    Description
    No description
    Configuration
    Running, 1 Spindle Down
    OEM Model Description
    The A-WD-200T is the first twin-spindle dicer for 200mm wafers. The A-WD-200T is a wafer dicing machine that features a face-to-face, twin-spindle arrangement and X-axis acceleration for outstanding throughput. The machine is equipped with a linear motor in the X-axis mechanism that enhances dicing quality by minimizing vibration. The color LCD touch-panel operation screen is easy to understand and convenient to use. Additionally, the X-axis drive mechanism is now entirely contact- and maintenance-free, making it a reliable and efficient choice for wafer dicing operations.
    Documents

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    ACCRETECH / TSK

    A-WD-200T

    verified-listing-icon

    Verified

    CATEGORY

    Scribing, Cutting, Dicing
    Last Verified: Over 60 days ago
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    48740


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown

    Have Additional Questions?
    Logistics Support
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    Money Back Guarantee
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    Transaction Insured by Moov
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    Refurbishment Services
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    Similar Listings
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    ACCRETECH / TSK A-WD-200T
    ACCRETECH / TSKA-WD-200TScribing, Cutting, Dicing
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    ACCRETECH / TSK

    A-WD-200T

    verified-listing-icon

    Verified

    CATEGORY

    Scribing, Cutting, Dicing
    Last Verified: Over 60 days ago
    listing-photo-823d2a1ff5484edcaa4be36c3d921e49-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/45076/823d2a1ff5484edcaa4be36c3d921e49/ea850d4757d543c7ab5e3b84d1682fc7_23f538a81f1441459f285788f5dfba311105c_mw.jpeg
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    48740


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    Running, 1 Spindle Down
    OEM Model Description
    The A-WD-200T is the first twin-spindle dicer for 200mm wafers. The A-WD-200T is a wafer dicing machine that features a face-to-face, twin-spindle arrangement and X-axis acceleration for outstanding throughput. The machine is equipped with a linear motor in the X-axis mechanism that enhances dicing quality by minimizing vibration. The color LCD touch-panel operation screen is easy to understand and convenient to use. Additionally, the X-axis drive mechanism is now entirely contact- and maintenance-free, making it a reliable and efficient choice for wafer dicing operations.
    Documents

    No documents

    Similar Listings
    View All
    ACCRETECH / TSK A-WD-200T
    ACCRETECH / TSK
    A-WD-200T
    Scribing, Cutting, DicingVintage: 0Condition: UsedLast Verified: Over 60 days ago
    ACCRETECH / TSK A-WD-200T
    ACCRETECH / TSK
    A-WD-200T
    Scribing, Cutting, DicingVintage: 0Condition: UsedLast Verified: Over 60 days ago
    ACCRETECH / TSK A-WD-200T
    ACCRETECH / TSK
    A-WD-200T
    Scribing, Cutting, DicingVintage: 2013Condition: UsedLast Verified: Over 60 days ago