Description
Poly EtchConfiguration
TCP9408SE Software Version Envision 1.6 - 012A CIM SECS Process CMOS Hardware Confguration Main System: LAM TCP 9400 ETCHER (1) Factory Interface: SMIF (2) AC Rack (1) PC Pump (1) TCU 4080 (1) LL PUMP (1) Heater Controller (1)OEM Model Description
The TCP 9400SE is a high density, low pressure etch system from Lam’s TCP product line. It incorporates the Company’s patented Transformer Coupled Plasma source technology for etching 0.35 micron and smaller geometries. The TCP 9400SE is used for polysilicon and polycide etch applications. It operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates with independent power control to the lower electrode, which improves etch results across a wider process window. Lam’s TCP systems are designed to offer customers a reliable, lower cost of ownership solution to their advanced needs. The TCP systems are available as stand-alone, single wafer tools, or on the Alliance multichamber cluster platform.Documents
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LAM RESEARCH CORPORATION
TCP 9400SE
Verified
CATEGORY
RIE
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
91876
Wafer Sizes:
8"/200mm
Vintage:
1993
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
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Refurbishment Services
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View AllLAM RESEARCH CORPORATION
TCP 9400SE
Verified
CATEGORY
RIE
Last Verified: 6 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
91876
Wafer Sizes:
8"/200mm
Vintage:
1993
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Poly EtchConfiguration
TCP9408SE Software Version Envision 1.6 - 012A CIM SECS Process CMOS Hardware Confguration Main System: LAM TCP 9400 ETCHER (1) Factory Interface: SMIF (2) AC Rack (1) PC Pump (1) TCU 4080 (1) LL PUMP (1) Heater Controller (1)OEM Model Description
The TCP 9400SE is a high density, low pressure etch system from Lam’s TCP product line. It incorporates the Company’s patented Transformer Coupled Plasma source technology for etching 0.35 micron and smaller geometries. The TCP 9400SE is used for polysilicon and polycide etch applications. It operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates with independent power control to the lower electrode, which improves etch results across a wider process window. Lam’s TCP systems are designed to offer customers a reliable, lower cost of ownership solution to their advanced needs. The TCP systems are available as stand-alone, single wafer tools, or on the Alliance multichamber cluster platform.Documents
No documents