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AL 2CH, TTN 1CH, SIP 2CH, ALPS 1CH, PcXT 1CH, Degas (STD) 2CHOEM Model Description
The Applied Materials ENDURA II is a highly advanced platform used in the semiconductor industry for physical vapor deposition (PVD) processes. It is designed to deposit thin films of various materials onto semiconductor wafers with exceptional precision and uniformity.Documents
No documents
APPLIED MATERIALS (AMAT)
ENDURA II
Verified
CATEGORY
PVD / Sputtering
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116997
Wafer Sizes:
12"/300mm
Vintage:
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
ENDURA II
CATEGORY
PVD / Sputtering
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116997
Wafer Sizes:
12"/300mm
Vintage:
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
AL 2CH, TTN 1CH, SIP 2CH, ALPS 1CH, PcXT 1CH, Degas (STD) 2CHOEM Model Description
The Applied Materials ENDURA II is a highly advanced platform used in the semiconductor industry for physical vapor deposition (PVD) processes. It is designed to deposit thin films of various materials onto semiconductor wafers with exceptional precision and uniformity.Documents
No documents