The Applied Materials ENDURA II is a highly advanced platform used in the semiconductor industry for physical vapor deposition (PVD) processes. It is designed to deposit thin films of various materials onto semiconductor wafers with exceptional precision and uniformity. 

Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

APPLIED MATERIALS (AMAT)

ENDURA II

PVD Single Chamber
ISAC controller + ISAC pcb
old version CCT + AIO, DIO, Interlock pcb.

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applied_materials_endura_II.pdf

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Co Sputter(CO:1 SIP-Ti:2 SICONI:2 DS-TTN:2  PC-XT:2)

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

ENDURA II

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APPLIED MATERIALS (AMAT)

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ENDURA II

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ENDURA II

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APPLIED MATERIALS (AMAT)

ENDURA II

APPLIED MATERIALS (AMAT)

ENDURA II

APPLIED MATERIALS (AMAT)

ENDURA II

APPLIED MATERIALS (AMAT)

ENDURA II