Description

TiN BS

Configuration

Loading Configuration - 3 Loadport Chamber E - Dual Mode Degas Chamber F - Dual Mode Degas Chamber 1 - RF PVD TiN LP Chamber 2 - RF PVD TiN LP Chamber 3 - RF PVD TiN LP Chamber 1/2/3 Chemicals/Gases Used - N2/Ar Chamber E, F Chemicals/Gases Used - Ar N2 Load Port Exists 1 - No N2 Load Port Exists 2 - No

OEM Model Description

The Applied Materials ENDURA II is a highly advanced platform used in the semiconductor industry for physical vapor deposition (PVD) processes. It is designed to deposit thin films of various materials onto semiconductor wafers with exceptional precision and uniformity.

Documents

amat_endura_II.pdf

APPLIED MATERIALS (AMAT)

ENDURA II

Verified

PVD / Sputtering

Last Verified: 25 days ago

Key Item Details

Condition:

Used

Operational Status:

Deinstalled / Crated

Product ID:

151310

Wafer Sizes:

Unknown

Vintage:

2020

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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