Description
PECVD (Chemical Vapor Deposition)Configuration
No ConfigurationOEM Model Description
The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.Documents
No documents
ASM
EAGLE XP
Verified
CATEGORY
ALD
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
26727
Wafer Sizes:
12"/300mm
Vintage:
2008
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
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Refurbishment Services
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EAGLE XP
Verified
CATEGORY
ALD
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
26727
Wafer Sizes:
12"/300mm
Vintage:
2008
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
PECVD (Chemical Vapor Deposition)Configuration
No ConfigurationOEM Model Description
The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.Documents
No documents