Description
Working ConditionConfiguration
Type 6 OCR Direct Docking for Ultraflex The main configurations include OCR, normal high temperature, Ni type chuck, clean pad, DD type (Direct Docking for Ultraflex) without hinge. Others are standardOEM Model Description
The UF3000EX-e is a fully automatic wafer prober that is also available for numerous special applications. It is uncompromising for throughput, very flexible for application, and has very precise navigation. It uses non-contact measurement and can handle wafers from 200 to 300 mm in diameter, including special types of wafers. The UF3000EX-e features a newly developed XY stage drive unit and a new algorithm for extremely high throughput, an improved Z-platform for the highest probe power, and a 15-inch LCD touch screen for easy operation. It also has an Optical Target Scope (OTS) for very precise measurements of the relative positions of probe cards and chucks, a tri-color 3-level magnifying function for color recording and 3 enhancement levels, and a navigation display function that allows the user to manage each desired wafer point by simply touching the wafer map.Documents
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ACCRETECH / TSK
UF3000EX-e
Verified
CATEGORY
Probers
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
91522
Wafer Sizes:
Unknown
Vintage:
Unknown
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ACCRETECH / TSK
UF3000EX-e
Verified
CATEGORY
Probers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
91522
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Working ConditionConfiguration
Type 6 OCR Direct Docking for Ultraflex The main configurations include OCR, normal high temperature, Ni type chuck, clean pad, DD type (Direct Docking for Ultraflex) without hinge. Others are standardOEM Model Description
The UF3000EX-e is a fully automatic wafer prober that is also available for numerous special applications. It is uncompromising for throughput, very flexible for application, and has very precise navigation. It uses non-contact measurement and can handle wafers from 200 to 300 mm in diameter, including special types of wafers. The UF3000EX-e features a newly developed XY stage drive unit and a new algorithm for extremely high throughput, an improved Z-platform for the highest probe power, and a 15-inch LCD touch screen for easy operation. It also has an Optical Target Scope (OTS) for very precise measurements of the relative positions of probe cards and chucks, a tri-color 3-level magnifying function for color recording and 3 enhancement levels, and a navigation display function that allows the user to manage each desired wafer point by simply touching the wafer map.Documents
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