Description
Dielectric EtchConfiguration
<p>Tool is operating in clean room.</p><p> </p><p>[Chamber A]</p><p>Chamber type:DRM</p><p>Gas config. (sccm)=FCS full scale</p><p> 2line(advanced radical distribution control)</p><p> Ar(754)/C4F8(43)/O2(46.8)/O2(1215)</p><p> CF4(336)/CHF3(163)/CH2F2(144)/N2(300)</p><p> CHF3(25)/O2(18.7)/N2(30)/CH2F2(14.4)</p><p>RF 13.56MHz, max 5000W</p><p>Temp Top +30~+80℃</p><p> Wall +40~+80℃</p><p> ESC -10~+60℃</p><p> </p><p>[Chamber B]</p><p>Chamber type:DRM</p><p>Gas config. (sccm)=FCS full scale</p><p> 2line(advanced radical distribution control)</p><p> Ar(754)/C4F8(43)/O2(46.8)/O2(1215)</p><p> CF4(336)/CHF3(163)/CH2F2(144)/N2(300)</p><p> CHF3(25)/O2(18.7)/N2(30)/CH2F2(14.4)</p><p>RF 13.56MHz, max 5000W</p><p>Temp Top +30~+80℃</p><p> Wall +40~+80℃</p><p> ESC -10~+60℃</p><p> </p><p> </p><p>Missing or damaged parts: Not reported.</p>OEM Model Description
Telius-SP is a high-performance etching system designed for large diameter (300 mm) requirements. It is part of the Telius platform and offers improved productivity through increased throughput, a reduced footprint, and higher energy efficiency. The system can be fitted with various chamber applications, including DRM and SCCM chambers, to support a wide range of process areas. It can support up to 4 chambers and boasts a high throughput, compact design, and low cost of ownership (CoO). Additionally, the system is designed for ease of maintenance. Overall, Telius-SP is a versatile and cost-effective solution for large diameter etching needs.Documents
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TEL / TOKYO ELECTRON
TELIUS SP 305 SCCM
Verified
CATEGORY
Plasma Etch
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
17811
Wafer Sizes:
12"/300mm
Vintage:
202004
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Logistics Support
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TEL / TOKYO ELECTRON
TELIUS SP 305 SCCM
Verified
CATEGORY
Plasma Etch
Last Verified: 26 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
17811
Wafer Sizes:
12"/300mm
Vintage:
202004
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Dielectric EtchConfiguration
<p>Tool is operating in clean room.</p><p> </p><p>[Chamber A]</p><p>Chamber type:DRM</p><p>Gas config. (sccm)=FCS full scale</p><p> 2line(advanced radical distribution control)</p><p> Ar(754)/C4F8(43)/O2(46.8)/O2(1215)</p><p> CF4(336)/CHF3(163)/CH2F2(144)/N2(300)</p><p> CHF3(25)/O2(18.7)/N2(30)/CH2F2(14.4)</p><p>RF 13.56MHz, max 5000W</p><p>Temp Top +30~+80℃</p><p> Wall +40~+80℃</p><p> ESC -10~+60℃</p><p> </p><p>[Chamber B]</p><p>Chamber type:DRM</p><p>Gas config. (sccm)=FCS full scale</p><p> 2line(advanced radical distribution control)</p><p> Ar(754)/C4F8(43)/O2(46.8)/O2(1215)</p><p> CF4(336)/CHF3(163)/CH2F2(144)/N2(300)</p><p> CHF3(25)/O2(18.7)/N2(30)/CH2F2(14.4)</p><p>RF 13.56MHz, max 5000W</p><p>Temp Top +30~+80℃</p><p> Wall +40~+80℃</p><p> ESC -10~+60℃</p><p> </p><p> </p><p>Missing or damaged parts: Not reported.</p>OEM Model Description
Telius-SP is a high-performance etching system designed for large diameter (300 mm) requirements. It is part of the Telius platform and offers improved productivity through increased throughput, a reduced footprint, and higher energy efficiency. The system can be fitted with various chamber applications, including DRM and SCCM chambers, to support a wide range of process areas. It can support up to 4 chambers and boasts a high throughput, compact design, and low cost of ownership (CoO). Additionally, the system is designed for ease of maintenance. Overall, Telius-SP is a versatile and cost-effective solution for large diameter etching needs.Documents
No documents
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