Description
Telius SP 305 SCCM Dielectric Etch Process Oxide Oxide Etch (3) Shin Chamber (6) EMO Front 3ea, Rear (3) RF Generator TOP (3) RF Generator BTM (3) RF Matcher TOP (3) RF Matcher BTM (12) Gas LineConfiguration
No ConfigurationOEM Model Description
Telius-SP is a high-performance etching system designed for large diameter (300 mm) requirements. It is part of the Telius platform and offers improved productivity through increased throughput, a reduced footprint, and higher energy efficiency. The system can be fitted with various chamber applications, including DRM and SCCM chambers, to support a wide range of process areas. It can support up to 4 chambers and boasts a high throughput, compact design, and low cost of ownership (CoO). Additionally, the system is designed for ease of maintenance. Overall, Telius-SP is a versatile and cost-effective solution for large diameter etching needs.Documents
TEL / TOKYO ELECTRON
TELIUS SP 305 SCCM
Verified
CATEGORY
Plasma Etch
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
81928
Wafer Sizes:
12"/300mm
Vintage:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
TELIUS SP 305 SCCM
Verified
CATEGORY
Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
81928
Wafer Sizes:
12"/300mm
Vintage:
2004
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Telius SP 305 SCCM Dielectric Etch Process Oxide Oxide Etch (3) Shin Chamber (6) EMO Front 3ea, Rear (3) RF Generator TOP (3) RF Generator BTM (3) RF Matcher TOP (3) RF Matcher BTM (12) Gas LineConfiguration
No ConfigurationOEM Model Description
Telius-SP is a high-performance etching system designed for large diameter (300 mm) requirements. It is part of the Telius platform and offers improved productivity through increased throughput, a reduced footprint, and higher energy efficiency. The system can be fitted with various chamber applications, including DRM and SCCM chambers, to support a wide range of process areas. It can support up to 4 chambers and boasts a high throughput, compact design, and low cost of ownership (CoO). Additionally, the system is designed for ease of maintenance. Overall, Telius-SP is a versatile and cost-effective solution for large diameter etching needs.Documents
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