TEL / TOKYO ELECTRON

TE 8500

TE5000 TEL’s first original dry etch tool

TE 5000

Tactras™ Vigus™ is a highly reliable 300mm plasma etch system that enhances etch process productivity. It provides customized options for high aspect ratio holes, trench etch, mask and dielectric etch, and BEOL. The system is designed to deliver excellent wafer uniformity, low wafer-to-wafer variation, and high selectivity for thin film stop layers while maintaining a high etch rate. Up to 6 Vigus™ chambers can be installed on the Tactras™ platform. Tactras™ Vigus™ contributes to maximizing productivity for semiconductor manufacturers with industry-leading tool availability by minimizing offset in machine-to-machine and chamber-to-chamber with robust design, particle reduction techniques, introducing unit-assembly inspection method before shipment, and unique labor-saving automated functions. Overall, Tactras™ Vigus™ is a highly efficient and versatile etching system that offers many benefits to its users.

TACTRAS VIGUS

Telius (300mm) etch systems.
Successor to the Unity, generally 4 chamber, but could support purge modules and other HW.

TELIUS

TELIUS SP

TE 5000SATC

TE 8500P

Tactras™ is a 300mm plasma etch system that enhances etch process productivity. It provides customized solutions for high aspect ratio holes, trench etch, mask and dielectric etch, and BEOL dielectric etch. The common base product design allows Tactras™ to be built for specific applications. The etch chambers that can be installed on Tactras™ employ optimal design technologies to achieve excellent within-wafer uniformity, low wafer-to-wafer variation, and high selectivity in shaping the etch profile. Up to 6 chambers can be installed on Tactras™, each capable of handling different etch applications as required. Tactras™ offers operational advantages enabled by TEL’s cumulative knowhow on production technology, including a robust design to minimize machine-to-machine and chamber-to-chamber variation, particle reduction technology, unit-assembly inspection, and labor-saving automation. All of these contribute to customers’ productivity.

TACTRAS

TACTRAS VIGUS-0

Telius-SP is a high-performance etching system designed for large diameter (300 mm) requirements. It is part of the Telius platform and offers improved productivity through increased throughput, a reduced footprint, and higher energy efficiency. The system can be fitted with various chamber applications, including DRM and SCCM chambers, to support a wide range of process areas. It can support up to 4 chambers and boasts a high throughput, compact design, and low cost of ownership (CoO). Additionally, the system is designed for ease of maintenance. Overall, Telius-SP is a versatile and cost-effective solution for large diameter etching needs.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

TEL / TOKYO ELECTRON

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Top TEL / TOKYO ELECTRON Plasma Etch

TE 8500

TE 5000

TACTRAS VIGUS

TELIUS

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