Description
Al, Ta Sputtering Process The C2 is using Ta-Al, Al-Cu targets for PVD sputtering on 6 inches wafers. The film is Ta-Al 1100 Ao, Al-Cu 5200 Ao. The production run rate is 75 wafers every pump down which translates to 2 hrs. Normally the machine can do 5-6 pump down on a 12 hours shift. That translates to about 375-450 wafers output per shift or 750-900 wafers per day. The current layout is Loadlock, Orienter / Desorb, Transport, 2 Process Chambers. More process chambers can be added depending on process needs. Each process chamber is equipped with an on-board 8 CryoPump.Configuration
-Cassette Load Lock Modules - Come with 3 casettes, a Motion Engineering Inc (MEI) 3 axis single arms robot, - Leybold TMP/NT 150/360V/H turbo pump -Desorb Modules For wafer orientation and lamps heating, Leybold TMP/NT 150/360V/H turbo pump -Transport Modules Brooks MultiTran 5 Bi-symmetric frog-leg type dual arm robot. Leybold TMP 151/361, 600 and 1000 turbo pump. -PVD Cathode AE MDX Magatron Drive Power Supply . CTI cryo on board 8 and 8300 compressor. VAT Gate valve series 14 AlCu target 14” diameter -PVD Cathode Same as 4. TaAl target 14” diameterOEM Model Description
The NOVELLUS CONCEPT TWO is a modular, integrated production system that is capable of depositing both dielectric and conductive metal layers by combining one or more processing chambers around a common, automated robotic wafer handler. It was introduced in November 1991.Documents
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LAM RESEARCH / NOVELLUS
CONCEPT TWO "C2"
Verified
CATEGORY
MOCVD
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
45660
Wafer Sizes:
6"/150mm
Vintage:
Unknown
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LAM RESEARCH / NOVELLUS
CONCEPT TWO "C2"
CATEGORY
MOCVD
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
45660
Wafer Sizes:
6"/150mm
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Al, Ta Sputtering Process The C2 is using Ta-Al, Al-Cu targets for PVD sputtering on 6 inches wafers. The film is Ta-Al 1100 Ao, Al-Cu 5200 Ao. The production run rate is 75 wafers every pump down which translates to 2 hrs. Normally the machine can do 5-6 pump down on a 12 hours shift. That translates to about 375-450 wafers output per shift or 750-900 wafers per day. The current layout is Loadlock, Orienter / Desorb, Transport, 2 Process Chambers. More process chambers can be added depending on process needs. Each process chamber is equipped with an on-board 8 CryoPump.Configuration
-Cassette Load Lock Modules - Come with 3 casettes, a Motion Engineering Inc (MEI) 3 axis single arms robot, - Leybold TMP/NT 150/360V/H turbo pump -Desorb Modules For wafer orientation and lamps heating, Leybold TMP/NT 150/360V/H turbo pump -Transport Modules Brooks MultiTran 5 Bi-symmetric frog-leg type dual arm robot. Leybold TMP 151/361, 600 and 1000 turbo pump. -PVD Cathode AE MDX Magatron Drive Power Supply . CTI cryo on board 8 and 8300 compressor. VAT Gate valve series 14 AlCu target 14” diameter -PVD Cathode Same as 4. TaAl target 14” diameterOEM Model Description
The NOVELLUS CONCEPT TWO is a modular, integrated production system that is capable of depositing both dielectric and conductive metal layers by combining one or more processing chambers around a common, automated robotic wafer handler. It was introduced in November 1991.Documents
No documents