LAM RESEARCH / NOVELLUS CONCEPT TWO "C2"

Description

No description

Configuration

W deposition with pulsed nucleation layer (PNL ) hardware and process capability Reactive Plasma Clean ( RPC) hardware. Chamber system that uses plasma NF3 rather than C2F6 Minimal Ovelap Exclusion Ring ( MOER)- keeps W from depositing on the edge of the wafer Installation & Training

OEM Model Description

The NOVELLUS CONCEPT TWO is a modular, integrated production system that is capable of depositing both dielectric and conductive metal layers by combining one or more processing chambers around a common, automated robotic wafer handler. It was introduced in November 1991.