Description
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W deposition with pulsed nucleation layer (PNL ) hardware and process capability Reactive Plasma Clean ( RPC) hardware. Chamber system that uses plasma NF3 rather than C2F6 Minimal Ovelap Exclusion Ring ( MOER)- keeps W from depositing on the edge of the wafer Installation & TrainingOEM Model Description
The NOVELLUS CONCEPT TWO is a modular, integrated production system that is capable of depositing both dielectric and conductive metal layers by combining one or more processing chambers around a common, automated robotic wafer handler. It was introduced in November 1991.Documents
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LAM RESEARCH / NOVELLUS
CONCEPT TWO "C2"
Verified
CATEGORY
MOCVD
Last Verified: Over 60 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
69602
Wafer Sizes:
8"/200mm
Vintage:
Unknown
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Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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LAM RESEARCH / NOVELLUS
CONCEPT TWO "C2"
CATEGORY
MOCVD
Last Verified: Over 60 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
69602
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
W deposition with pulsed nucleation layer (PNL ) hardware and process capability Reactive Plasma Clean ( RPC) hardware. Chamber system that uses plasma NF3 rather than C2F6 Minimal Ovelap Exclusion Ring ( MOER)- keeps W from depositing on the edge of the wafer Installation & TrainingOEM Model Description
The NOVELLUS CONCEPT TWO is a modular, integrated production system that is capable of depositing both dielectric and conductive metal layers by combining one or more processing chambers around a common, automated robotic wafer handler. It was introduced in November 1991.Documents
No documents