Description

Non-contact CV/IV Measurement System

Configuration

. Automatic robotic wafer handling . Single open-cassette wafer loading station . Measurement of dielectric and interface properties on monitor wafer - Dielectric Capacitance (CD) and Thickness (EOT) - Dielectric Leakage Current (I-V) - Flatband Voltage (Vfb) - Interface Trap Density (Dit) - Interface Trapped Charge (Qit) - Semiconductor Surface Barrier (Vsb) - Oxide Total Charge (Qtot) - Mobile Ionic Charge (Qm), among others . Suitable for measurement on: - Semiconductor wafers (e.g. Si, SiGe, InGaAs, SiC, GaN) with high-k and low-k dielectric films (e.g. SiO2, SiNx, Al2O3, HfO2 ;..)

OEM Model Description

The SEMILAB FAAST 230 is a non-contact, fast in-line monitoring system designed to detect heavy metal contamination, including sub 108 atoms/cm-3 Fe detection, in a medium to high-volume manufacturing environment. It features automated wafer handling, with options for SMIF/FOUP Loadport/Versaport, and can perform full wafer FAST mapping of diffusion length, Iron, and other recombination centers. The system is configurable for 100 mm to 300 mm wafers and is compatible with other Semilab SDI FAaST tool measurement technologies. Additional options include a minienvironment, wafer edge-grip handling, wafer flipper for automatic backsurface measurement, and more.