Description
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DP + SPV + SILC working condition 200MM waferOEM Model Description
The SEMILAB FAAST 230 is a non-contact, fast in-line monitoring system designed to detect heavy metal contamination, including sub 108 atoms/cm-3 Fe detection, in a medium to high-volume manufacturing environment. It features automated wafer handling, with options for SMIF/FOUP Loadport/Versaport, and can perform full wafer FAST mapping of diffusion length, Iron, and other recombination centers. The system is configurable for 100 mm to 300 mm wafers and is compatible with other Semilab SDI FAaST tool measurement technologies. Additional options include a minienvironment, wafer edge-grip handling, wafer flipper for automatic backsurface measurement, and more.Documents
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SEMILAB
FAAST 230
Verified
CATEGORY
Metrology
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
66386
Wafer Sizes:
8"/200mm
Vintage:
Unknown
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Logistics Support
Available
Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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View AllSEMILAB
FAAST 230
Verified
CATEGORY
Metrology
Last Verified: Over 30 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
66386
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
DP + SPV + SILC working condition 200MM waferOEM Model Description
The SEMILAB FAAST 230 is a non-contact, fast in-line monitoring system designed to detect heavy metal contamination, including sub 108 atoms/cm-3 Fe detection, in a medium to high-volume manufacturing environment. It features automated wafer handling, with options for SMIF/FOUP Loadport/Versaport, and can perform full wafer FAST mapping of diffusion length, Iron, and other recombination centers. The system is configurable for 100 mm to 300 mm wafers and is compatible with other Semilab SDI FAaST tool measurement technologies. Additional options include a minienvironment, wafer edge-grip handling, wafer flipper for automatic backsurface measurement, and more.Documents
No documents