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ALD SiNOEM Model Description
The TELINDY is a 300mm wafer processing platform that combines the advantages of the TELFORMULA and ALPHA(α)-303i platforms to meet the demands of high-volume thermal processing for sub-45nm technology. It offers a large 125-wafer batch size, high-speed robotics, and other improvements for cost-effective processing of various oxidation and deposited films. The TELINDY platform is suitable for a range of applications, including general oxidation/anneal, radical oxidation, LPCVD films, ultra-low temperature LPCVD applications, and high-k dielectrics. It features in-situ dry gas cleaning technology, a fast ramp-up and cool-down heater, high-speed robotics, and a large 125-wafer load size. These features make the TELINDY an excellent choice for cost-effective and efficient wafer processing.Documents
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TEL / TOKYO ELECTRON
TELINDY
Verified
CATEGORY
Furnaces / Diffusion
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116864
Wafer Sizes:
12"/300mm
Vintage:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
TELINDY
CATEGORY
Furnaces / Diffusion
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116864
Wafer Sizes:
12"/300mm
Vintage:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
ALD SiNOEM Model Description
The TELINDY is a 300mm wafer processing platform that combines the advantages of the TELFORMULA and ALPHA(α)-303i platforms to meet the demands of high-volume thermal processing for sub-45nm technology. It offers a large 125-wafer batch size, high-speed robotics, and other improvements for cost-effective processing of various oxidation and deposited films. The TELINDY platform is suitable for a range of applications, including general oxidation/anneal, radical oxidation, LPCVD films, ultra-low temperature LPCVD applications, and high-k dielectrics. It features in-situ dry gas cleaning technology, a fast ramp-up and cool-down heater, high-speed robotics, and a large 125-wafer load size. These features make the TELINDY an excellent choice for cost-effective and efficient wafer processing.Documents
No documents