Description
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3 x FOUP (25 wafers) ULPA filters Control Monitor Maintenance monitor 10 chamber mainframe CP1 Bevel Etch / Clean CP2 Bevel Etch / Clean CP3 ECD Cu CP4 ECD Cu CP5 ECD Cu CP6 ECD Cu CP7 ECD Cu CP8 ECD Cu CP9 Bevel Etch / Clean CP10 Bevel Etch / Clean Tank 1 (20 liter) Process Tank 2 (10 liter) Mix Tank3 (180 liter) Cathaolyte RTA profile Voltage variation analysis Spectrology analyst RTA probe Voltage variation analysts Spectrology analyst Tan 4 (65 liters) – Anolyte Ph probe Spectrology analyst Fire SuppressioOEM Model Description
The Raider™ ECD310 is a fourth-generation, single-wafer, automated, multi-process electrochemical deposition tool. It delivers advanced metal processing in a small footprint and is available with cluster modules for metrology, plating, and cleaning. The Raider™ ECD310 incorporates programmable reactors that provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to deliver advanced metal processing capabilities in a compact package.Documents
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APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER ECD310
Verified
CATEGORY
Electro Plating
Last Verified: 22 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
113539
Wafer Sizes:
12"/300mm
Vintage:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER ECD310
CATEGORY
Electro Plating
Last Verified: 22 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
113539
Wafer Sizes:
12"/300mm
Vintage:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
3 x FOUP (25 wafers) ULPA filters Control Monitor Maintenance monitor 10 chamber mainframe CP1 Bevel Etch / Clean CP2 Bevel Etch / Clean CP3 ECD Cu CP4 ECD Cu CP5 ECD Cu CP6 ECD Cu CP7 ECD Cu CP8 ECD Cu CP9 Bevel Etch / Clean CP10 Bevel Etch / Clean Tank 1 (20 liter) Process Tank 2 (10 liter) Mix Tank3 (180 liter) Cathaolyte RTA profile Voltage variation analysis Spectrology analyst RTA probe Voltage variation analysts Spectrology analyst Tan 4 (65 liters) – Anolyte Ph probe Spectrology analyst Fire SuppressioOEM Model Description
The Raider™ ECD310 is a fourth-generation, single-wafer, automated, multi-process electrochemical deposition tool. It delivers advanced metal processing in a small footprint and is available with cluster modules for metrology, plating, and cleaning. The Raider™ ECD310 incorporates programmable reactors that provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to deliver advanced metal processing capabilities in a compact package.Documents
No documents