Description
No descriptionConfiguration
Process: Cu Ox Software Version: 1.8.4 SP17 HF7 Number of Loadports: 3 -Chm/Unit Position 1: Exelan 23EX1771 N2, He/O2, C4F6, CH2F2, CHF3, O2, H2, Ar, CF4, C4F8 iGX6/100 -Chm/Unit Position 2 Exelan 23EX1772 N2, He/O2, C4F6, CH2F2, CHF3, O2, H2, Ar, CF4, C4F8 iGX6/100 -Chm/Unit Position 3 Exelan 23EX1773 N2, He/O2, C4F6, CH2F2, CHF3, O2, H2, Ar, CF4, C4F8 iGX6/100 -Chm/Unit Position 4 Exelan 23EX1774 N2, He/O2, C4F6, CH2F2, CHF3, O2, H2, Ar, CF4, C4F8 iGX6/100OEM Model Description
The 2300 Exelan Flex is a dielectric etch solution that extends the capabilities of the 2300 Exelan to address manufacturing challenges for 200 mm and 300 mm while providing advanced capabilities for future manufacturing needs. It incorporates Dual Frequency Confined™ (DFC™) technology and the Waferless AutoClean™ process, with additional technology that allows customers to address future production challenges via increased 193 nm photoresist compatibility, enhanced uniformity and CD control, and enlarged process windows. The 2300 Exelan Flex’s innovative technology has been production proven at numerous leading IC manufacturers.Documents
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CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
130002
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH CORPORATION
2300 EXELAN FLEX
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
130002
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Process: Cu Ox Software Version: 1.8.4 SP17 HF7 Number of Loadports: 3 -Chm/Unit Position 1: Exelan 23EX1771 N2, He/O2, C4F6, CH2F2, CHF3, O2, H2, Ar, CF4, C4F8 iGX6/100 -Chm/Unit Position 2 Exelan 23EX1772 N2, He/O2, C4F6, CH2F2, CHF3, O2, H2, Ar, CF4, C4F8 iGX6/100 -Chm/Unit Position 3 Exelan 23EX1773 N2, He/O2, C4F6, CH2F2, CHF3, O2, H2, Ar, CF4, C4F8 iGX6/100 -Chm/Unit Position 4 Exelan 23EX1774 N2, He/O2, C4F6, CH2F2, CHF3, O2, H2, Ar, CF4, C4F8 iGX6/100OEM Model Description
The 2300 Exelan Flex is a dielectric etch solution that extends the capabilities of the 2300 Exelan to address manufacturing challenges for 200 mm and 300 mm while providing advanced capabilities for future manufacturing needs. It incorporates Dual Frequency Confined™ (DFC™) technology and the Waferless AutoClean™ process, with additional technology that allows customers to address future production challenges via increased 193 nm photoresist compatibility, enhanced uniformity and CD control, and enlarged process windows. The 2300 Exelan Flex’s innovative technology has been production proven at numerous leading IC manufacturers.Documents
No documents