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LAM RESEARCH CORPORATION 2300 EXELAN FLEX
  • LAM RESEARCH CORPORATION 2300 EXELAN FLEX
Description
Lam 2300 EXELAN Flex Chamber only
Configuration
No Configuration
OEM Model Description
The 2300 Exelan Flex is a dielectric etch solution that extends the capabilities of the 2300 Exelan to address manufacturing challenges for 200 mm and 300 mm while providing advanced capabilities for future manufacturing needs. It incorporates Dual Frequency Confined™ (DFC™) technology and the Waferless AutoClean™ process, with additional technology that allows customers to address future production challenges via increased 193 nm photoresist compatibility, enhanced uniformity and CD control, and enlarged process windows. The 2300 Exelan Flex’s innovative technology has been production proven at numerous leading IC manufacturers.
Documents

No documents

CATEGORY
Dry / Plasma Etch

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

81941


Wafer Sizes:

12"/300mm


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH CORPORATION

2300 EXELAN FLEX

verified-listing-icon
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
listing-photo-dd9d70a2031d4d648efdc0bd9073c8e5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/48608/dd9d70a2031d4d648efdc0bd9073c8e5/9996a6b7815747da89303a6993ede051_b339faf534764686ac5be6af6aa90d1b1201a_mw.jpeg
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

81941


Wafer Sizes:

12"/300mm


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Lam 2300 EXELAN Flex Chamber only
Configuration
No Configuration
OEM Model Description
The 2300 Exelan Flex is a dielectric etch solution that extends the capabilities of the 2300 Exelan to address manufacturing challenges for 200 mm and 300 mm while providing advanced capabilities for future manufacturing needs. It incorporates Dual Frequency Confined™ (DFC™) technology and the Waferless AutoClean™ process, with additional technology that allows customers to address future production challenges via increased 193 nm photoresist compatibility, enhanced uniformity and CD control, and enlarged process windows. The 2300 Exelan Flex’s innovative technology has been production proven at numerous leading IC manufacturers.
Documents

No documents

Similar Listings
View All