Description
Dielectric EtchConfiguration
Tool Status: Chamber has been shut down and deinstalled and moved to the warehouse. Configuration. Audit to verify. LAM FXP Chamber only with RF unit and gas box.OEM Model Description
The 2300 Exelan Flex is a dielectric etch solution that extends the capabilities of the 2300 Exelan to address manufacturing challenges for 200 mm and 300 mm while providing advanced capabilities for future manufacturing needs. It incorporates Dual Frequency Confined™ (DFC™) technology and the Waferless AutoClean™ process, with additional technology that allows customers to address future production challenges via increased 193 nm photoresist compatibility, enhanced uniformity and CD control, and enlarged process windows. The 2300 Exelan Flex’s innovative technology has been production proven at numerous leading IC manufacturers.Documents
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LAM RESEARCH CORPORATION
2300 EXELAN FLEX
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: 15 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
23058
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH CORPORATION
2300 EXELAN FLEX
CATEGORY
Dry / Plasma Etch
Last Verified: 15 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
23058
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Dielectric EtchConfiguration
Tool Status: Chamber has been shut down and deinstalled and moved to the warehouse. Configuration. Audit to verify. LAM FXP Chamber only with RF unit and gas box.OEM Model Description
The 2300 Exelan Flex is a dielectric etch solution that extends the capabilities of the 2300 Exelan to address manufacturing challenges for 200 mm and 300 mm while providing advanced capabilities for future manufacturing needs. It incorporates Dual Frequency Confined™ (DFC™) technology and the Waferless AutoClean™ process, with additional technology that allows customers to address future production challenges via increased 193 nm photoresist compatibility, enhanced uniformity and CD control, and enlarged process windows. The 2300 Exelan Flex’s innovative technology has been production proven at numerous leading IC manufacturers.Documents
No documents