Description
No descriptionConfiguration
RIE of SiO2, SiNx and Si 2 chambers with full gas panel Computerized endpoint system ESC wafer handling for minimum edge exclusion Remanufactured P5000 system for RIE of Oxides and Nitrides Mainframe 150mm, SNNF wafers, through the wall fit 15 slot storage elevator, Phase IV Robot Polyimide ESC for etch uniformity and low particles Endpoint Computer with monochromators Gas panel custom built, with process & chemistries Chambers A- MxP Oxide, Oxide/Nitride Etch gas panel B- MxP Oxide, Oxide/Nitride Etch gas panel new process kits fully rebuilt and tested gas box with MFC's fully calibrated RF and PSU components all system interconnect, and heat exchangersOEM Model Description
The AMAT P5000 Etch is a magnetically enhanced reactive ion etching system (MERIE) with two functional process chambers (Chambers B & C). P5000 Chamber B is primarily used for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.) and some carbon based compounds (resist, poly imide, etc) while chamber C is mainly used for silicon etching with high selectivity to underlying dielectric such as silicon dioxide. The system can process only 4" wafers. Pieces have to be attached to a 4" wafer. Though the process chamber processes one wafer at a time, up to 25 wafers can be loaded per batch.Documents
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APPLIED MATERIALS (AMAT)
P5000 ETCH
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: 6 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
94021
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
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APPLIED MATERIALS (AMAT)
P5000 ETCH
CATEGORY
Dry / Plasma Etch
Last Verified: 6 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
94021
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
RIE of SiO2, SiNx and Si 2 chambers with full gas panel Computerized endpoint system ESC wafer handling for minimum edge exclusion Remanufactured P5000 system for RIE of Oxides and Nitrides Mainframe 150mm, SNNF wafers, through the wall fit 15 slot storage elevator, Phase IV Robot Polyimide ESC for etch uniformity and low particles Endpoint Computer with monochromators Gas panel custom built, with process & chemistries Chambers A- MxP Oxide, Oxide/Nitride Etch gas panel B- MxP Oxide, Oxide/Nitride Etch gas panel new process kits fully rebuilt and tested gas box with MFC's fully calibrated RF and PSU components all system interconnect, and heat exchangersOEM Model Description
The AMAT P5000 Etch is a magnetically enhanced reactive ion etching system (MERIE) with two functional process chambers (Chambers B & C). P5000 Chamber B is primarily used for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.) and some carbon based compounds (resist, poly imide, etc) while chamber C is mainly used for silicon etching with high selectivity to underlying dielectric such as silicon dioxide. The system can process only 4" wafers. Pieces have to be attached to a 4" wafer. Though the process chamber processes one wafer at a time, up to 25 wafers can be loaded per batch.Documents
No documents